XC7Z045-2FFG900I
- Part Number:
- XC7Z045-2FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668424-XC7Z045-2FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z045-2FFG900I
Xilinx Inc. XC7Z045-2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FFG900I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B900
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-2
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Description
- FAQs
- Shipping
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply should be used.There is no safe voltage for the SoCs wireless above 1.05V.Having 900 terminations in total makes system on a chip possible.By searching XC7Z045, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900I System On Chip (SoC) applications.
Optical drive
High-end PLC
POS Terminals
Smartphone accessories
CNC control
System-on-chip (SoC)
Digital Media
Temperature
AC drive control module
Automated sorting equipment
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply should be used.There is no safe voltage for the SoCs wireless above 1.05V.Having 900 terminations in total makes system on a chip possible.By searching XC7Z045, you will find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900I System On Chip (SoC) applications.
Optical drive
High-end PLC
POS Terminals
Smartphone accessories
CNC control
System-on-chip (SoC)
Digital Media
Temperature
AC drive control module
Automated sorting equipment
XC7Z045-2FFG900I More Descriptions
ARM-ASeries 800MHz 130 FBGA-900 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z045-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XC7Z045-2FFG900I
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-900
Processors - Application Specialized XC7Z045-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XC7Z045-2FFG900I
The three parts on the right have similar specifications to XC7Z045-2FFG900I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusNumber of PinsMountAdditional FeatureMax Supply VoltageMin Supply VoltagePropagation DelayTurn On Delay TimeNumber of RegistersWidthView Compare
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XC7Z045-2FFG900I10 WeeksCopper, Silver, Tin900-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045S-PBGA-B9001V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mmNoROHS3 Compliant----------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045S-PBGA-B6761V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mmNoROHS3 Compliant---------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045-1V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant676--------
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30----CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 Compliant900Surface MountPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY1.05V950mV120 ps120 ps55480031mm
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