XC7Z045-2FFG900CES

Xilinx Inc. XC7Z045-2FFG900CES

Part Number:
XC7Z045-2FFG900CES
Manufacturer:
Xilinx Inc.
Ventron No:
3162610-XC7Z045-2FFG900CES
Description:
IC SOC CORTEX-A9 KINTEX7 900FBGA
ECAD Model:
Datasheet:
XC7Z045-2FFG900CES

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Specifications
Xilinx Inc. XC7Z045-2FFG900CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FFG900CES.
  • Package / Case
    900-BBGA, FCBGA
  • Supplier Device Package
    900-FCBGA (31x31)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Frequency
    800MHz
  • Base Part Number
    XC7Z045
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • Speed
    800MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os are available in this SoC part.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.wireless SoCs operate at 800MHz.In this SoC meaning, ARM serves as the core architecture.Just 0°C will start the SoC computing.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-2FFG900CES System On Chip (SoC) applications.

Optical drive
Healthcare
sequence controllers
Vending machines
POS Terminals
Industrial transport
Medical
Cyber security for critical applications in the aerospace
Communication interfaces ( I2C, SPI )
Networked sensors
XC7Z045-2FFG900CES More Descriptions
Cap Aluminum Lytic 220uF 25V 20% (8 X 11mm) Radial 3.5mm 290mA 2000h 85C Bulk
IC SOC CORTEX-A9 KINTEX7 900FBGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 667MHZ 676FCBGA
Product Comparison
The three parts on the right have similar specifications to XC7Z045-2FFG900CES.
  • Image
    Part Number
    Manufacturer
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Primary Attributes
    RoHS Status
    Factory Lead Time
    Surface Mount
    JESD-609 Code
    Pbfree Code
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Clock Frequency
    Boundary Scan
    RAM (words)
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    Contact Plating
    Mount
    Number of Pins
    ECCN Code
    Additional Feature
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Turn On Delay Time
    Number of Registers
    View Compare
  • XC7Z045-2FFG900CES
    XC7Z045-2FFG900CES
    900-BBGA, FCBGA
    900-FCBGA (31x31)
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    Obsolete
    4 (72 Hours)
    85°C
    0°C
    800MHz
    XC7Z045
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    800MHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    Kintex™-7 FPGA, 350K Logic Cells
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z012S-2CLG485I
    484-LFBGA, CSPBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    150
    766MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    Artix™-7 FPGA, 55K Logic Cells
    ROHS3 Compliant
    10 Weeks
    YES
    e3
    yes
    485
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B485
    1.05V
    0.95V
    800MHz
    YES
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    130
    1GHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    Kintex™-7 FPGA, 350K Logic Cells
    ROHS3 Compliant
    10 Weeks
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    4 (72 Hours)
    -
    -
    800MHz
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    Kintex™-7 FPGA, 444K Logic Cells
    ROHS3 Compliant
    10 Weeks
    -
    e1
    -
    900
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    30
    -
    -
    -
    -
    YES
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    Copper, Silver, Tin
    Surface Mount
    900
    3A991.D
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    1.05V
    950mV
    120 ps
    120 ps
    554800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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