Xilinx Inc. XC7Z045-2FFG900CES
- Part Number:
- XC7Z045-2FFG900CES
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162610-XC7Z045-2FFG900CES
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z045-2FFG900CES
Xilinx Inc. XC7Z045-2FFG900CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FFG900CES.
- Package / Case900-BBGA, FCBGA
- Supplier Device Package900-FCBGA (31x31)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency800MHz
- Base Part NumberXC7Z045
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- Speed800MHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- RoHS StatusRoHS Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os are available in this SoC part.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.wireless SoCs operate at 800MHz.In this SoC meaning, ARM serves as the core architecture.Just 0°C will start the SoC computing.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900CES System On Chip (SoC) applications.
Optical drive
Healthcare
sequence controllers
Vending machines
POS Terminals
Industrial transport
Medical
Cyber security for critical applications in the aerospace
Communication interfaces ( I2C, SPI )
Networked sensors
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq?-7000 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os are available in this SoC part.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.wireless SoCs operate at 800MHz.In this SoC meaning, ARM serves as the core architecture.Just 0°C will start the SoC computing.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FFG900CES System On Chip (SoC) applications.
Optical drive
Healthcare
sequence controllers
Vending machines
POS Terminals
Industrial transport
Medical
Cyber security for critical applications in the aerospace
Communication interfaces ( I2C, SPI )
Networked sensors
XC7Z045-2FFG900CES More Descriptions
Cap Aluminum Lytic 220uF 25V 20% (8 X 11mm) Radial 3.5mm 290mA 2000h 85C Bulk
IC SOC CORTEX-A9 KINTEX7 900FBGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 667MHZ 676FCBGA
The three parts on the right have similar specifications to XC7Z045-2FFG900CES.
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ImagePart NumberManufacturerPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesRoHS StatusFactory Lead TimeSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Clock FrequencyBoundary ScanRAM (words)Bus CompatibilityHeight Seated (Max)LengthWidthContact PlatingMountNumber of PinsECCN CodeAdditional FeatureMax Supply VoltageMin Supply VoltagePropagation DelayTurn On Delay TimeNumber of RegistersView Compare
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XC7Z045-2FFG900CES900-BBGA, FCBGA900-FCBGA (31x31)0°C~85°C TJTray2010Zynq®-7000Obsolete4 (72 Hours)85°C0°C800MHzXC7Z045CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130800MHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMKintex™-7 FPGA, 350K Logic CellsRoHS Compliant-----------------------------------
-
484-LFBGA, CSPBGA--40°C~100°C TJTray2016Zynq®-7000Active3 (168 Hours)-----150766MHz256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-Artix™-7 FPGA, 55K Logic CellsROHS3 Compliant10 WeeksYESe3yes485Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mmNOT SPECIFIEDS-PBGA-B4851.05V0.95V800MHzYES256000CAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm19mm----------
-
676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000Active4 (72 Hours)-----1301GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-Kintex™-7 FPGA, 350K Logic CellsROHS3 Compliant10 Weeks---------------------------------
-
900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000Active4 (72 Hours)--800MHz-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMKintex™-7 FPGA, 444K Logic CellsROHS3 Compliant10 Weeks-e1-900Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm30----YES256000CAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmCopper, Silver, TinSurface Mount9003A991.DPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY1.05V950mV120 ps120 ps554800
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