XC7Z030-2FBG484E

Xilinx Inc. XC7Z030-2FBG484E

Part Number:
XC7Z030-2FBG484E
Manufacturer:
Xilinx Inc.
Ventron No:
3162542-XC7Z030-2FBG484E
Description:
IC SOC CORTEX-A9 KINTEX7 484FBGA
ECAD Model:
Datasheet:
XC7Z030-2FBG484E

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Specifications
Xilinx Inc. XC7Z030-2FBG484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-2FBG484E.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    484-BBGA, FCBGA
  • Surface Mount
    YES
  • Number of Pins
    484
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    484
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    800MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z030
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -2
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 125K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.At least 0.95V can be supplied as a power source.system on a chip benefits from 484 terminations.Search XC7Z030 for system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC is the 484-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-2FBG484E System On Chip (SoC) applications.

Remote control
Wireless sensor networks
Automotive
Mouse
Communication network-on-Chip (cNoC)
Measurement tools
Level
String inverter
Efficient hardware for inference of neural networks
Optical drive
XC7Z030-2FBG484E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 484-Pin FCBGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-2FBG484E
IC SOC CORTEX-A9 800MHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-2FBG484E
Product Comparison
The three parts on the right have similar specifications to XC7Z030-2FBG484E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Pbfree Code
    JESD-30 Code
    Speed
    Clock Frequency
    Width
    Contact Plating
    Operating Supply Voltage
    Memory Type
    View Compare
  • XC7Z030-2FBG484E
    XC7Z030-2FBG484E
    10 Weeks
    484-BBGA, FCBGA
    YES
    484
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    484
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    250
    1V
    1mm
    800MHz
    30
    XC7Z030
    1.05V
    0.95V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 125K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    23mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z014S-1CLG484I
    10 Weeks
    484-LFBGA, CSPBGA
    YES
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    Active
    3 (168 Hours)
    484
    -
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    -
    NOT SPECIFIED
    -
    1.05V
    0.95V
    -
    200
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    YES
    -
    256000
    Artix™-7 FPGA, 65K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    -
    ROHS3 Compliant
    yes
    S-PBGA-B484
    667MHz
    667MHz
    19mm
    -
    -
    -
  • XC7Z012S-2CLG485I
    10 Weeks
    484-LFBGA, CSPBGA
    YES
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    Active
    3 (168 Hours)
    485
    -
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    -
    NOT SPECIFIED
    -
    1.05V
    0.95V
    -
    150
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    YES
    -
    256000
    Artix™-7 FPGA, 55K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    -
    ROHS3 Compliant
    yes
    S-PBGA-B485
    766MHz
    800MHz
    19mm
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    676-BBGA, FCBGA
    YES
    -
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    1.05V
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    No
    ROHS3 Compliant
    -
    S-PBGA-B676
    -
    -
    -
    Copper, Silver, Tin
    1V
    ROMless
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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