Xilinx Inc. XC7Z030-2FBG484E
- Part Number:
- XC7Z030-2FBG484E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162542-XC7Z030-2FBG484E
- Description:
- IC SOC CORTEX-A9 KINTEX7 484FBGA
- Datasheet:
- XC7Z030-2FBG484E
Xilinx Inc. XC7Z030-2FBG484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-2FBG484E.
- Factory Lead Time10 Weeks
- Package / Case484-BBGA, FCBGA
- Surface MountYES
- Number of Pins484
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations484
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z030
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-2
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 125K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length23mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.At least 0.95V can be supplied as a power source.system on a chip benefits from 484 terminations.Search XC7Z030 for system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC is the 484-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FBG484E System On Chip (SoC) applications.
Remote control
Wireless sensor networks
Automotive
Mouse
Communication network-on-Chip (cNoC)
Measurement tools
Level
String inverter
Efficient hardware for inference of neural networks
Optical drive
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.05V.At least 0.95V can be supplied as a power source.system on a chip benefits from 484 terminations.Search XC7Z030 for system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC is the 484-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FBG484E System On Chip (SoC) applications.
Remote control
Wireless sensor networks
Automotive
Mouse
Communication network-on-Chip (cNoC)
Measurement tools
Level
String inverter
Efficient hardware for inference of neural networks
Optical drive
XC7Z030-2FBG484E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 484-Pin FCBGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-2FBG484E
IC SOC CORTEX-A9 800MHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-2FBG484E
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-484
Processors - Application Specialized XC7Z030-2FBG484E
IC SOC CORTEX-A9 800MHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-484; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-2FBG484E
The three parts on the right have similar specifications to XC7Z030-2FBG484E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusPbfree CodeJESD-30 CodeSpeedClock FrequencyWidthContact PlatingOperating Supply VoltageMemory TypeView Compare
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XC7Z030-2FBG484E10 Weeks484-BBGA, FCBGAYES4840°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)484EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2501V1mm800MHz30XC7Z0301.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 125K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm23mmNoROHS3 Compliant---------
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10 Weeks484-LFBGA, CSPBGAYES--40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)484-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED-1.05V0.95V-200256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 65K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 CompliantyesS-PBGA-B484667MHz667MHz19mm---
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10 Weeks484-LFBGA, CSPBGAYES--40°C~100°C TJTray2016Zynq®-7000e3Active3 (168 Hours)485-Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mm-NOT SPECIFIED-1.05V0.95V-150256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--YES-256000Artix™-7 FPGA, 55K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm19mm-ROHS3 CompliantyesS-PBGA-B485766MHz800MHz19mm---
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10 Weeks676-BBGA, FCBGAYES-0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z0451.05V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mmNoROHS3 Compliant-S-PBGA-B676---Copper, Silver, Tin1VROMless
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