Xilinx Inc. XC7Z030-1FFG676C

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.Ideally, a power supply with a voltage of 1V should be used.In the SoCs wireless, voltages above 1.05V are considered unsafe.The system on a chip uses 676 terminations in total.A search for XC7Z030 will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.Based on the core architecture of ARM, the SoC meaning has a high level of performance.The computer SoC has a pin count of 676.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z030-1FFG676C System On Chip (SoC) applications.

Mobile computing
POS Terminals
Industrial AC-DC
Self-aware system-on-chip (SoC)
Temperature
CNC control
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