XC7Z015-2CLG485I

Xilinx Inc. XC7Z015-2CLG485I

Part Number:
XC7Z015-2CLG485I
Manufacturer:
Xilinx Inc.
Ventron No:
3163274-XC7Z015-2CLG485I
Description:
IC SOC CORTEX-A9 ARTIX-7 485BGA
ECAD Model:
Datasheet:
XC7Z015-2CLG485I

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Specifications
Xilinx Inc. XC7Z015-2CLG485I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z015-2CLG485I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    484-LFBGA, CSPBGA
  • Number of Pins
    485
  • Supplier Device Package
    485-CSBGA (19x19)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Frequency
    766MHz
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • Speed
    766MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Max Frequency
    766MHz
  • Primary Attributes
    Artix™-7 FPGA, 74K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.The manufacturer assigns this system on a chip with a 484-LFBGA, CSPBGA package.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 74K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.There is 766MHz frequency associated with the wireless SoC.Core architecture of ARM underpins the SoC meaning.This is the version with 485 pins.In order for the SoC computing to start, -40°C is just about right.This SoC system on chip operates at a maximum design temperature of 100°C.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z015-2CLG485I System On Chip (SoC) applications.

AC-input BLDC motor drive
Wireless sensor networks
Special Issue Editors
Smart appliances
High-end PLC
Communication network-on-Chip (cNoC)
Video Imaging
Sensor network-on-chip (sNoC)
Industrial AC-DC
ARM support modules
XC7Z015-2CLG485I More Descriptions
FPGA Artix-7 Family 74000 Cells 28nm Technology Automotive Medical 484-Pin CSBGA
MPU Zynq-7000 RISC 32-Bit 766MHz 1.5V/2V/2.5V 485-Pin CSBGA
CSBGA-485 Programmable Logic Device (CPLDs/FPGAs) ROHS
PSOC, ARM CORTEX-A9, 766MHZ, CSBGA-485
Processors - Application Specialized XC7Z015-2CLG485I
IC SOC CORTEX-A9 766MHZ 485CSBGA
IC SOC CORTEX-M3 166MHZ 484FBGA
Psoc, Arm Cortex-A9, 766Mhz, Csbga-485; Product Range:zynq Family 7000S Series Microprocessors; Cpu Speed:766Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:csbga; No. Of Pins:485Pins; Mpu Family:zynq; Mpu Series:7000S; Rohs Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC7Z015-2CLG485I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Interface
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Max Frequency
    Primary Attributes
    RoHS Status
    Surface Mount
    JESD-609 Code
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Memory Type
    Boundary Scan
    Speed Grade
    RAM (words)
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    JESD-30 Code
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    View Compare
  • XC7Z015-2CLG485I
    XC7Z015-2CLG485I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    484-LFBGA, CSPBGA
    485
    485-CSBGA (19x19)
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    3 (168 Hours)
    100°C
    -40°C
    766MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    766MHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    766MHz
    Artix™-7 FPGA, 74K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FBG676I
    10 Weeks
    Copper, Silver, Tin
    -
    676-BBGA, FCBGA
    676
    -
    -40°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    Active
    3 (168 Hours)
    -
    -
    800MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    -
    Kintex™-7 FPGA, 350K Logic Cells
    ROHS3 Compliant
    YES
    e1
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    30
    XC7Z045
    1V
    1.05V
    ROMless
    YES
    -2
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    No
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    3 (168 Hours)
    -
    -
    800MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    -
    Kintex™-7 FPGA, 275K Logic Cells
    ROHS3 Compliant
    -
    e1
    676
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    NOT SPECIFIED
    -
    -
    -
    -
    YES
    3
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    S-PBGA-B676
    1.05V
    950mV
    110 ps
    343800
    27mm
  • XC7Z045-3FFV676E
    10 Weeks
    -
    -
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    Active
    4 (72 Hours)
    -
    -
    -
    -
    130
    1GHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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