Xilinx Inc. XC7Z007S-1CLG400I
- Part Number:
- XC7Z007S-1CLG400I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162329-XC7Z007S-1CLG400I
- Description:
- IC FPGA SOC 100I/O 400BGA
- Datasheet:
- XC7Z007S-1CLG400I
Xilinx Inc. XC7Z007S-1CLG400I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z007S-1CLG400I.
- Factory Lead Time10 Weeks
- Package / Case400-LFBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq®-7000
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- Terminal FinishMatte Tin (Sn)
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B400
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- Number of I/O100
- Speed667MHz
- RAM Size256KB
- Core ProcessorSingle ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Clock Frequency667MHz
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesArtix™-7 FPGA, 23K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)1.6mm
- Length17mm
- Width17mm
- RoHS StatusROHS3 Compliant
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Single ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.This system on a chip is packaged as 400-LFBGA, CSPBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines Artix?-7 FPGA, 23K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 100 I/Os.A power supply with a 1V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.05V.This SoC system on a chip can run on a power supply that is at least 0.95V.There are 400 terminations in total and that really benefits system on a chip.A 667MHz clock frequency is used by this SoC.
Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG400I System On Chip (SoC) applications.
Defense
Central alarm system
Robotics
Measurement tools
Self-aware system-on-chip (SoC)
Cyberphysical system-on-chip
Video Imaging
Fitness
Transmitters
Efficient hardware for inference of neural networks
A core processor Single ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.This system on a chip is packaged as 400-LFBGA, CSPBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines Artix?-7 FPGA, 23K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 100 I/Os.A power supply with a 1V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.05V.This SoC system on a chip can run on a power supply that is at least 0.95V.There are 400 terminations in total and that really benefits system on a chip.A 667MHz clock frequency is used by this SoC.
Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG400I System On Chip (SoC) applications.
Defense
Central alarm system
Robotics
Measurement tools
Self-aware system-on-chip (SoC)
Cyberphysical system-on-chip
Video Imaging
Fitness
Transmitters
Efficient hardware for inference of neural networks
XC7Z007S-1CLG400I More Descriptions
FPGA Zynq-7000 Family 23000 Cells 667MHz 28nm 1V 400-Pin WCBGA TrayAvnet Japan
Processors - Application Specialized XC7Z007S-1CLG400I
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
IC SOC CORTEX-A9 667MHZ 400BGA
Screws & Fasteners HEX NUT 15/32-32
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
Processors - Application Specialized XC7Z007S-1CLG400I
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
IC SOC CORTEX-A9 667MHZ 400BGA
Screws & Fasteners HEX NUT 15/32-32
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
The three parts on the right have similar specifications to XC7Z007S-1CLG400I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsClock FrequencyConnectivityArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusContact PlatingMountFrequencyInterfaceMax Supply VoltageMin Supply VoltagePropagation DelayCore ArchitectureSpeed GradeNumber of RegistersNumber of PinsECCN CodeAdditional FeatureTurn On Delay TimeView Compare
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XC7Z007S-1CLG400I10 Weeks400-LFBGA, CSPBGAYES-40°C~100°C TJTray2016Zynq®-7000e3yesActive3 (168 Hours)400Matte Tin (Sn)8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED1V0.8mmNOT SPECIFIEDS-PBGA-B4001.05V0.95V100667MHz256KBSingle ARM® Cortex®-A9 MPCore™ with CoreSight™DMA667MHzCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Artix™-7 FPGA, 23K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB1.6mm17mm17mmROHS3 Compliant---------------
-
10 Weeks676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000--Active4 (72 Hours)-------------1301GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant--------------
-
10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1-Active3 (168 Hours)676Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-NOT SPECIFIEDS-PBGA-B676--130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 CompliantCopper, Silver, TinSurface Mount667MHzCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV120 psARM1343800----
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10 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2010Zynq®-7000e1-Active4 (72 Hours)900Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm30---130-256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmROHS3 CompliantCopper, Silver, TinSurface Mount800MHzCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV120 psARM-5548009003A991.DPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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