XC7Z007S-1CLG400I

Xilinx Inc. XC7Z007S-1CLG400I

Part Number:
XC7Z007S-1CLG400I
Manufacturer:
Xilinx Inc.
Ventron No:
3162329-XC7Z007S-1CLG400I
Description:
IC FPGA SOC 100I/O 400BGA
ECAD Model:
Datasheet:
XC7Z007S-1CLG400I

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Specifications
Xilinx Inc. XC7Z007S-1CLG400I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z007S-1CLG400I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    400-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq®-7000
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    400
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B400
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Number of I/O
    100
  • Speed
    667MHz
  • RAM Size
    256KB
  • Core Processor
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Clock Frequency
    667MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Artix™-7 FPGA, 23K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    1.6mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Single ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.This system on a chip is packaged as 400-LFBGA, CSPBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq?-7000 is the series name of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines Artix?-7 FPGA, 23K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 100 I/Os.A power supply with a 1V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.05V.This SoC system on a chip can run on a power supply that is at least 0.95V.There are 400 terminations in total and that really benefits system on a chip.A 667MHz clock frequency is used by this SoC.

Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 667MHz

There are a lot of Xilinx Inc.
XC7Z007S-1CLG400I System On Chip (SoC) applications.

Defense
Central alarm system
Robotics
Measurement tools
Self-aware system-on-chip (SoC)
Cyberphysical system-on-chip
Video Imaging
Fitness
Transmitters
Efficient hardware for inference of neural networks
XC7Z007S-1CLG400I More Descriptions
FPGA Zynq-7000 Family 23000 Cells 667MHz 28nm 1V 400-Pin WCBGA TrayAvnet Japan
Processors - Application Specialized XC7Z007S-1CLG400I
PSOC, ARM CORTEX-A9, 667MHZ, BGA-400
IC SOC CORTEX-A9 667MHZ 400BGA
Screws & Fasteners HEX NUT 15/32-32
Psoc, Arm Cortex-A9, 667Mhz, Bga-400; Product Range:zynq Family 7000S Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:arm Cortex-A9; Mpu Case Style:bga; No. Of Pins:400Pins; Automotive Qualification Standard:-; Msl:- Rohs Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC7Z007S-1CLG400I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Clock Frequency
    Connectivity
    Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Contact Plating
    Mount
    Frequency
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Core Architecture
    Speed Grade
    Number of Registers
    Number of Pins
    ECCN Code
    Additional Feature
    Turn On Delay Time
    View Compare
  • XC7Z007S-1CLG400I
    XC7Z007S-1CLG400I
    10 Weeks
    400-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    yes
    Active
    3 (168 Hours)
    400
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B400
    1.05V
    0.95V
    100
    667MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    667MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Artix™-7 FPGA, 23K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    17mm
    17mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    1GHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    3 (168 Hours)
    676
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    667MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    120 ps
    ARM
    1
    343800
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    4 (72 Hours)
    900
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    30
    -
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    800MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    120 ps
    ARM
    -
    554800
    900
    3A991.D
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    120 ps
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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