Xilinx Inc. XC7VX485T-2FFG1157C
- Part Number:
- XC7VX485T-2FFG1157C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635307-XC7VX485T-2FFG1157C
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Datasheet:
- XC7VX485T-2FFG1157C
Xilinx Inc. XC7VX485T-2FFG1157C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7VX485T-2FFG1157C.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Supplier Device Package1157-FCBGA (35x35)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2010
- SeriesVirtex®-7 XT
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Voltage - Supply0.97V~1.03V
- Base Part NumberXC7VX485T
- Operating Supply Voltage1V
- Number of I/O600
- RAM Size4.5MB
- Number of Logic Elements/Cells485760
- Total RAM Bits37969920
- Number of LABs/CLBs37950
- Number of Logic Blocks (LABs)37950
- Speed Grade-2
- Number of Registers607200
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
XC7VX485T-2FFG1157C Overview
The manufacturer of this component is Xilinx Inc., a company specializing in Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is designed to be mounted on a surface and has an operating temperature range of 0°C to 85°C TJ. It is packaged in a tray and is currently in active production. The maximum operating temperature for this chip is 85°C, while the minimum is 0°C. It has a RAM size of 4.5MB and a total of 37969920 RAM bits. It also has 37950 logic blocks (LABs) and a speed grade of -2.
XC7VX485T-2FFG1157C Features
600 I/Os
Up to 37969920 RAM bits
85°C gates
37950 logic blocks (LABs)
607200 registers
XC7VX485T-2FFG1157C Applications
There are a lot of Xilinx Inc. XC7VX485T-2FFG1157C FPGAs applications.
Integrating multiple SPLDs
Wired Communications
Server Applications
DO-254
Bioinformatics
Aerospace and Defense
Digital signal processing
Military DSP
Electronic Warfare
Medical ultrasounds
The manufacturer of this component is Xilinx Inc., a company specializing in Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is designed to be mounted on a surface and has an operating temperature range of 0°C to 85°C TJ. It is packaged in a tray and is currently in active production. The maximum operating temperature for this chip is 85°C, while the minimum is 0°C. It has a RAM size of 4.5MB and a total of 37969920 RAM bits. It also has 37950 logic blocks (LABs) and a speed grade of -2.
XC7VX485T-2FFG1157C Features
600 I/Os
Up to 37969920 RAM bits
85°C gates
37950 logic blocks (LABs)
607200 registers
XC7VX485T-2FFG1157C Applications
There are a lot of Xilinx Inc. XC7VX485T-2FFG1157C FPGAs applications.
Integrating multiple SPLDs
Wired Communications
Server Applications
DO-254
Bioinformatics
Aerospace and Defense
Digital signal processing
Military DSP
Electronic Warfare
Medical ultrasounds
XC7VX485T-2FFG1157C More Descriptions
FPGA Virtex-7 XT Family 485760 Cells 28nm Technology 1V 1157-Pin FC-BGA
Field Programmable Gate Array, 37950 CLBs, 1818MHz, 485760-Cell, CMOS, PBGA1158
Virtex-7 FPGA, 700 Max User I/O, Speed Grade-2, 56 GTX, FFG1157, RoHSXilinx SCT
Flip Flop D-Type Bus Interface Pos-Edge 1-Element 16-Pin SOIC T/R
Field Programmable Gate Array, 37950 CLBs, 1818MHz, 485760-Cell, CMOS, PBGA1158
Virtex-7 FPGA, 700 Max User I/O, Speed Grade-2, 56 GTX, FFG1157, RoHSXilinx SCT
Flip Flop D-Type Bus Interface Pos-Edge 1-Element 16-Pin SOIC T/R
The three parts on the right have similar specifications to XC7VX485T-2FFG1157C.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureVoltage - SupplyBase Part NumberOperating Supply VoltageNumber of I/ORAM SizeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of Logic Blocks (LABs)Speed GradeNumber of RegistersRadiation HardeningRoHS StatusMountJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable Logic TypeCombinatorial Delay of a CLB-MaxSubcategoryTechnologyTerminal PitchNumber of OutputsPower SuppliesClock FrequencyPropagation DelayNumber of InputsLengthHeight Seated (Max)WidthView Compare
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XC7VX485T-2FFG1157C10 WeeksSurface Mount1156-BBGA, FCBGA1157-FCBGA (35x35)0°C~85°C TJTray2010Virtex®-7 XTActive4 (72 Hours)85°C0°C0.97V~1.03VXC7VX485T1V6004.5MB485760379699203795037950-2607200NoROHS3 Compliant------------------------------
-
--FCBGA-------100°C0°C---4004.1MB580480--45350---RoHS CompliantSurface Mounte1yes11553A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01BOTTOMBALLNOT SPECIFIED1VNOT SPECIFIED1155S-PBGA-B11551.03V0.97VFIELD PROGRAMMABLE GATE ARRAY0.61 ns-----------
-
--FCBGA------4 (72 Hours)100°C0°C--1V6006.5MB693120--54150-866400NoRoHS CompliantSurface Mounte1yes19273A001.A.7.BTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01BOTTOMBALL-1V-1927S-PBGA-B19271.03V-FIELD PROGRAMMABLE GATE ARRAY0.61 nsField Programmable Gate ArraysCMOS1mm60011.8V1818MHz100 ps60045mm3.65mm45mm
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10 WeeksSurface Mount1760-BBGA, FCBGA-0°C~85°C TJTray2010Virtex®-7 XTActive4 (72 Hours)--0.97V~1.03VXC7VX690T1V8506.5MB6931205419008054150-2866400NoNon-RoHS CompliantSurface Mount------BOTTOMBALL----S-PBGA-B1760--FIELD PROGRAMMABLE GATE ARRAY-Field Programmable Gate ArraysCMOS1mm85011.8V1818MHz100 ps850---
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