Xilinx Inc. XC7K325T-3FBG676E

XC7K325T-3FBG676E Overview
The integrated circuit in question has a staggering number of 676 pins, making it a highly complex and advanced component. While the peak reflow temperature is not specified, it is safe to assume that it can withstand high temperatures due to its robust design. The terminal pitch, or distance between pins, is a mere 1mm, showcasing the precision and compactness of this chip. Despite its impressive specifications, the qualification status of this IC is currently marked as not qualified, indicating that it has not yet undergone all necessary testing and certifications. With a RAM size of 2MB and a clock frequency of 1412MHz, this chip is capable of handling large amounts of data at high speeds. Its 326080 logic elements/cells and a combinatorial delay of 0.58ns further demonstrate its impressive capabilities. All of this is packed into a compact 27mm length, making it a highly versatile and efficient component for various electronic applications.

XC7K325T-3FBG676E Features
400 I/Os
Up to 16404480 RAM bits
676 LABs/CLBs
407600 registers

XC7K325T-3FBG676E Applications
There are a lot of Xilinx Inc. XC7K325T-3FBG676E FPGAs applications.

Wireless Communications
Military DSP
Data Mining
Radar and Sensors
Camera time adjustments
DO-254
Space Applications
Embedded Vision
Automotive advanced driver assistance systems (ADAS)
Aerospace and Defense