Xilinx Inc. XC7A100T-2FGG676C

XC7A100T-2FGG676C Overview
The package or case for this particular product is a 676-BGA, which is a Ball Grid Array with 676 balls. The packaging method used for this product is a tray, which is a flat container used for storing and transporting electronic components. The JESD-609 code for this product is e1, indicating that it meets the industry standard for handling and shipping sensitive electronic devices. The part status of this product is active, meaning it is currently in production and available for purchase. The moisture sensitivity level (MSL) is 3, indicating that the product can withstand a maximum of 168 hours of exposure to moisture without being damaged. The HTS code for this product is 8542.39.00.01, which is used for classifying goods for import and export purposes. The terminal position for this product is bottom, meaning the pins or terminals are located on the bottom of the package. The peak reflow temperature is not specified, meaning it can be determined by the user based on their specific needs. This product is a field programmable gate array (FPGA), which is a type of programmable logic device. It contains 101440 logic elements or cells, making it a highly versatile and powerful device for various applications.

XC7A100T-2FGG676C Features
300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
126800 registers

XC7A100T-2FGG676C Applications
There are a lot of Xilinx Inc. XC7A100T-2FGG676C FPGAs applications.

Random logic
Medical Electronics
Video & Image Processing
Voice recognition
Integrating multiple SPLDs
Automotive advanced driver assistance systems (ADAS)
Secure Communication
Wireless Communications
Aerospace and Defense
Wired Communications