Xilinx Inc. XC6SLX9-3CSG324I
- Part Number:
- XC6SLX9-3CSG324I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3632848-XC6SLX9-3CSG324I
- Description:
- IC FPGA 200 I/O 324CSBGA
- Datasheet:
- XC6SLX9-3CSG324I
Xilinx Inc. XC6SLX9-3CSG324I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX9-3CSG324I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case324-LFBGA, CSPBGA
- Number of Pins324
- Supplier Device Package324-CSPBGA (15x15)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2008
- SeriesSpartan®-6 LX
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Voltage - Supply1.14V~1.26V
- Base Part NumberXC6SLX9
- Operating Supply Voltage1.2V
- Number of I/O200
- RAM Size72kB
- Number of Logic Elements/Cells9152
- Total RAM Bits589824
- Number of LABs/CLBs715
- Number of Logic Blocks (LABs)715
- Speed Grade3
- Number of Registers11440
- RoHS StatusROHS3 Compliant
XC6SLX9-3CSG324I Overview
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be mounted on the surface and has a total of 324 pins. The supplier device package is 324-CSPBGA (15x15) and the part is currently active in production. It has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to moisture. The minimum operating temperature for this chip is -40°C and it has a RAM size of 72kB. Additionally, it has 11440 registers and is compliant with the ROHS3 standard.
XC6SLX9-3CSG324I Features
200 I/Os
Up to 589824 RAM bits
324 LABs/CLBs
100°C gates
715 logic blocks (LABs)
11440 registers
XC6SLX9-3CSG324I Applications
There are a lot of Xilinx Inc. XC6SLX9-3CSG324I FPGAs applications.
Automotive driver's assistance
Enterprise networking
Defense Applications
Secure Communication
Telecommunication
Distributed Monetary Systems
Ecosystem
Medical Electronics
Industrial Ethernet
Data Center
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be mounted on the surface and has a total of 324 pins. The supplier device package is 324-CSPBGA (15x15) and the part is currently active in production. It has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to moisture. The minimum operating temperature for this chip is -40°C and it has a RAM size of 72kB. Additionally, it has 11440 registers and is compliant with the ROHS3 standard.
XC6SLX9-3CSG324I Features
200 I/Os
Up to 589824 RAM bits
324 LABs/CLBs
100°C gates
715 logic blocks (LABs)
11440 registers
XC6SLX9-3CSG324I Applications
There are a lot of Xilinx Inc. XC6SLX9-3CSG324I FPGAs applications.
Automotive driver's assistance
Enterprise networking
Defense Applications
Secure Communication
Telecommunication
Distributed Monetary Systems
Ecosystem
Medical Electronics
Industrial Ethernet
Data Center
XC6SLX9-3CSG324I More Descriptions
FPGA Spartan-6 LX Family 9152 Cells 45nm (CMOS) Technology 1.2V 324-Pin CS-BGA
Spartan-6 FPGA, 200 Max User I/O, Speed Grade-3, Logic Cells 9152, CSG324, RoHSXilinx SCT
Field Programmable Gate Array, 715 CLBs, 862MHz, 9152-Cell, CMOS, PBGA256
FPGA - Field Programmable Gate Array XC6SLX9-3CSG324I
Spartan-6 FPGA, 200 Max User I/O, Speed Grade-3, Logic Cells 9152, CSG324, RoHSXilinx SCT
Field Programmable Gate Array, 715 CLBs, 862MHz, 9152-Cell, CMOS, PBGA256
FPGA - Field Programmable Gate Array XC6SLX9-3CSG324I
The three parts on the right have similar specifications to XC6SLX9-3CSG324I.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureVoltage - SupplyBase Part NumberOperating Supply VoltageNumber of I/ORAM SizeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of Logic Blocks (LABs)Speed GradeNumber of RegistersRoHS StatusJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusPower SuppliesProgrammable Logic TypeCombinatorial Delay of a CLB-MaxNumber of CLBsHeight Seated (Max)LengthWidthReach Compliance CodeTime@Peak Reflow Temperature-Max (s)View Compare
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XC6SLX9-3CSG324I10 WeeksSurface MountSurface Mount324-LFBGA, CSPBGA324324-CSPBGA (15x15)-40°C~100°C TJTray2008Spartan®-6 LXActive3 (168 Hours)100°C-40°C1.14V~1.26VXC6SLX91.2V20072kB9152589824715715311440ROHS3 Compliant---------------------------
-
10 WeeksSurface MountSurface Mount256-LBGA256--40°C~100°C TJTray2008Spartan®-6 LXActive3 (168 Hours)--1.14V~1.26VXC6SLX91V18672kB9152589824715--11440ROHS3 Compliante1yes256EAR99Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2601V1mm30256186Not Qualified12.5/3.3VFIELD PROGRAMMABLE GATE ARRAY0.46 ns7151.55mm17mm17mm--
-
10 WeeksSurface MountSurface Mount256-LBGA256-0°C~85°C TJTray2008Spartan®-6 LXActive3 (168 Hours)--1.14V~1.26VXC6SLX91V18672kB9152589824715--11440ROHS3 Compliante1yes256EAR99Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2601V1mm30256186Not Qualified12.5/3.3VFIELD PROGRAMMABLE GATE ARRAY0.46 ns7151.55mm17mm17mm--
-
-Surface MountSurface Mount484-BBGA484-0°C~85°C TJTray2008Spartan®-6 LXTObsolete3 (168 Hours)--1.14V~1.26VXC6SLX100-296603kB10126149397767911---RoHS Compliante1-484-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL250-1mm-484296Not Qualified1.22.5/3.3VFIELD PROGRAMMABLE GATE ARRAY--2.6mm23mm23mmunknown30
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