XC5VLX50-1FFG324CES

Xilinx Inc. XC5VLX50-1FFG324CES

Part Number:
XC5VLX50-1FFG324CES
Manufacturer:
Xilinx Inc.
Ventron No:
3639310-XC5VLX50-1FFG324CES
Description:
IC FPGA 220 I/O 324FBGA
ECAD Model:
Datasheet:
XC5VLX50-1FFG324CES

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Specifications
Xilinx Inc. XC5VLX50-1FFG324CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC5VLX50-1FFG324CES.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    324-BBGA, FCBGA
  • Supplier Device Package
    324-FCBGA (19x19)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    Virtex®-5 LX
  • Published
    1999
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    0.95V~1.05V
  • Base Part Number
    XC5VLX50
  • Number of I/O
    220
  • RAM Size
    216kB
  • Number of Logic Elements/Cells
    46080
  • Total RAM Bits
    1769472
  • Number of LABs/CLBs
    3600
  • Number of Logic Blocks (LABs)
    3600
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
XC5VLX50-1FFG324CES Overview
In the 324-BBGA, FCBGA package, you will find fpga chips. The device has 220 I/O ports for more coherent data transfer. To form a fundamental building block, there are 46080 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.95V~1.05V-volt supply voltage required for the device to operate. The Virtex®-5 LX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1769472 bFpga chipss. You can find related parts by using the part number XC5VLX50, which is its base part number. It is crucial that the RAM si216kBe of this FPGA module reaches 216kB so that the program can run normally. A total of 3600 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between 0°C and the operating temperature. A basic building block of this system consists of 3600 logic blocks (LABs). Its supplier package is called 324-FCBGA (19x19).

XC5VLX50-1FFG324CES Features
220 I/Os
Up to 1769472 RAM bits
85°C gates
3600 logic blocks (LABs)


XC5VLX50-1FFG324CES Applications
There are a lot of Xilinx Inc.
XC5VLX50-1FFG324CES FPGAs applications.


Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
XC5VLX50-1FFG324CES More Descriptions
IC FPGA 220 I/O 324FCBGA
IC FPGA 400 I/O 676FCBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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