Xilinx Inc. XC4VSX35-11FFG668I
- Part Number:
- XC4VSX35-11FFG668I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3135494-XC4VSX35-11FFG668I
- Description:
- IC FPGA 448 I/O 668FCBGA
- Datasheet:
- XC4VSX35-11FFG668I
Xilinx Inc. XC4VSX35-11FFG668I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VSX35-11FFG668I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case668-BBGA, FCBGA
- Number of Pins668
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1998
- SeriesVirtex®-4 SX
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations668
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC4VSX35
- Pin Count668
- Number of Outputs448
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Number of I/O448
- RAM Size432kB
- Clock Frequency1205MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells34560
- Total RAM Bits3538944
- Number of LABs/CLBs3840
- Speed Grade11
- Height Seated (Max)2.85mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
XC4VSX35-11FFG668I Overview
The 668-BBGA and FCBGA packages were first published in 1998 and have a terminal form of BALL. The peak reflow temperature for this product is 245 degrees Celsius and it operates at a supply voltage of 1.2V. The terminal pitch is 1mm and it is not compliant with Reach regulations. With a total of 448 I/O, this product is a FIELD PROGRAMMABLE GATE ARRAY. It is also ROHS3 compliant.
XC4VSX35-11FFG668I Features
448 I/Os
Up to 3538944 RAM bits
668 LABs/CLBs
XC4VSX35-11FFG668I Applications
There are a lot of Xilinx Inc. XC4VSX35-11FFG668I FPGAs applications.
ADAS
Filtering and communication encoding
Industrial IoT
Voice recognition
Wireless Communications
Medical Electronics
Software-defined radios
Scientific Instruments
Distributed Monetary Systems
Telecommunication
The 668-BBGA and FCBGA packages were first published in 1998 and have a terminal form of BALL. The peak reflow temperature for this product is 245 degrees Celsius and it operates at a supply voltage of 1.2V. The terminal pitch is 1mm and it is not compliant with Reach regulations. With a total of 448 I/O, this product is a FIELD PROGRAMMABLE GATE ARRAY. It is also ROHS3 compliant.
XC4VSX35-11FFG668I Features
448 I/Os
Up to 3538944 RAM bits
668 LABs/CLBs
XC4VSX35-11FFG668I Applications
There are a lot of Xilinx Inc. XC4VSX35-11FFG668I FPGAs applications.
ADAS
Filtering and communication encoding
Industrial IoT
Voice recognition
Wireless Communications
Medical Electronics
Software-defined radios
Scientific Instruments
Distributed Monetary Systems
Telecommunication
XC4VSX35-11FFG668I More Descriptions
FPGA Virtex-4 SX Family 34560 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
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