XC4VSX35-10FFG668I

Xilinx Inc. XC4VSX35-10FFG668I

Part Number:
XC4VSX35-10FFG668I
Manufacturer:
Xilinx Inc.
Ventron No:
3135393-XC4VSX35-10FFG668I
Description:
IC FPGA 448 I/O 668FCBGA
ECAD Model:
Datasheet:
XC4VSX35-10FFG668I

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Specifications
Xilinx Inc. XC4VSX35-10FFG668I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VSX35-10FFG668I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    668-BBGA, FCBGA
  • Number of Pins
    668
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-4 SX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    668
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VSX35
  • Pin Count
    668
  • Number of Outputs
    448
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    448
  • RAM Size
    432kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    34560
  • Total RAM Bits
    3538944
  • Number of LABs/CLBs
    3840
  • Speed Grade
    10
  • Height Seated (Max)
    2.85mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC4VSX35-10FFG668I Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first introduced in 1999 and is coded as JESD-609 with a designation of e1. Its Moisture Sensitivity Level (MSL) is 4, meaning it can withstand exposure to moisture for up to 72 hours. The recommended Peak Reflow Temperature is 245 degrees Celsius. Currently, it has not yet been qualified for use. It operates at a voltage of 1.2V and has a total of 448 input/output connections. The number of Logic Elements/Cells is 34560 and it has a Total RAM Bits of 3538944. This component is also compliant with the Restriction of Hazardous Substances (RoHS) directive, specifically meeting the requirements of ROHS3.

XC4VSX35-10FFG668I Features
448 I/Os
Up to 3538944 RAM bits
668 LABs/CLBs

XC4VSX35-10FFG668I Applications
There are a lot of Xilinx Inc. XC4VSX35-10FFG668I FPGAs applications.

Integrating multiple SPLDs
Automation
Aircraft navigation
Medical imaging
Consumer Electronics
Embedded Vision
Electronic Warfare
OpenCL
Security systems
Automotive advanced driver assistance systems (ADAS)
XC4VSX35-10FFG668I More Descriptions
FPGA Virtex-4 SX Family 34560 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
Field Programmable Gate Array, 3840 CLBs, 1028MHz, 34560-Cell, CMOS, PBGA668
FCBGA-668 Programmable Logic Device (CPLDs/FPGAs) ROHS
Product Description Demo for Development.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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