XC4VFX12-11FFG668I

Xilinx Inc. XC4VFX12-11FFG668I

Part Number:
XC4VFX12-11FFG668I
Manufacturer:
Xilinx Inc.
Ventron No:
3635563-XC4VFX12-11FFG668I
Description:
IC FPGA 320 I/O 668FCBGA
ECAD Model:
Datasheet:
XC4VFX12-11FFG668I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XC4VFX12-11FFG668I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VFX12-11FFG668I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    668-BBGA, FCBGA
  • Number of Pins
    668
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-4 FX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    668
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VFX12
  • Pin Count
    668
  • Number of Outputs
    320
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    320
  • RAM Size
    81kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    12312
  • Total RAM Bits
    663552
  • Number of LABs/CLBs
    1368
  • Speed Grade
    11
  • Height Seated (Max)
    2.85mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC4VFX12-11FFG668I Overview
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip belonging to the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 1999 and has a peak reflow temperature of 245 degrees Celsius. The mount is surface mount and the packaging is tray. The number of pins is 668 and the terminal position is bottom. It has a terminal pitch of 1mm and a speed grade of 11. Additionally, it is ROHS3 compliant with a number of logic elements/cells of 12312.

XC4VFX12-11FFG668I Features
320 I/Os
Up to 663552 RAM bits
668 LABs/CLBs

XC4VFX12-11FFG668I Applications
There are a lot of Xilinx Inc. XC4VFX12-11FFG668I FPGAs applications.

Video & Image Processing
Aircraft navigation
Scientific Instruments
Secure Communication
Space Applications
Server Applications
Military Temperature
Military DSP
Enterprise networking
Artificial intelligence (AI)
XC4VFX12-11FFG668I More Descriptions
FPGA Virtex-4 FX Family 12312 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
Field Programmable Gate Array, 1181MHz, 12312-Cell, CMOS, PBGA363
Product Description Demo for Development.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.