Xilinx Inc. XC4VFX12-10SFG363I

XC4VFX12-10SFG363I Overview
The Surface Mount technology, also known as SMT, has become increasingly popular in the electronics industry since its introduction in 1960s. This type of mounting allows for a more compact and efficient design of electronic components. One such example is the Tray packaging method, which was first introduced in 1998. This method involves placing the electronic components in a tray for protection during transportation and storage. The JESD-609 Code, also known as e1, is a standard used in the industry to specify the packaging and handling requirements for electronic devices. The HTS Code, 8542.39.00.01, is used for customs purposes and identifies the type of electronic component. The Terminal Form of this particular component is BALL, which refers to the shape of its terminals. With a length and width of 17mm, this component is relatively small and can withstand a peak reflow temperature of 260 degrees Celsius. However, it is important to note that this component is currently not qualified for use in electronic devices.

XC4VFX12-10SFG363I Features
240 I/Os
Up to 663552 RAM bits
363 LABs/CLBs

XC4VFX12-10SFG363I Applications
There are a lot of Xilinx Inc. XC4VFX12-10SFG363I FPGAs applications.

Audio
Device controllers
Software-defined radios
Video & Image Processing
Space Applications
Camera time adjustments
Automotive driver's assistance
Random logic
Digital signal processing
Distributed Monetary Systems