Xilinx Inc. XC3S400-4FTG256C

Name: XC3S400-4FTG256C
Brand: Xilinx Inc.
SKU: 3632220-XC3S400-4FTG256C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC3S400-4FTG256C

Manufacturer:: Xilinx Inc.

Ventron No:: 3632220-XC3S400-4FTG256C

Description:: IC FPGA 173 I/O 256FTBGA

ECAD Model:

Datasheet:: XC3S400-4FTG256C

Specifications

Xilinx Inc. XC3S400-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400-4FTG256C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Spartan®-3
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
EAR99
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.2V
Reflow Temperature-Max (s)
30
Base Part Number
XC3S400
Pin Count
256
Number of Outputs
173
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.32.5V
Number of I/O
173
RAM Size
36kB
Clock Frequency
630MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
8064
Total RAM Bits
294912
Number of Gates
400000
Number of LABs/CLBs
896
Speed Grade
4
Combinatorial Delay of a CLB-Max
0.61 ns
Number of CLBs
896
Height
1mm
Length
17mm
Width
17mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free

Description

XC3S400-4FTG256C Overview
The manufacturer of this component is Xilinx Inc., a company specializing in Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It was first released in 2009 and has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The maximum reflow temperature for this chip is 30 degrees Celsius. Its Base Part Number is XC3S400 and it has a pin count of 256. This chip has 173 outputs and a total of 294912 bits of Random Access Memory (RAM). The maximum combinatorial delay for a Configurable Logic Block (CLB) is 0.61 nanoseconds. This chip has a height of 1mm and a length of 17mm.

XC3S400-4FTG256C Features
173 I/Os
Up to 294912 RAM bits
256 LABs/CLBs

XC3S400-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S400-4FTG256C FPGAs applications.

Secure Communication
Server Applications
Military DSP
Medical ultrasounds
Telecommunication
Ecosystem
Medical Electronics
Digital signal processing
Medical imaging
Data Mining

XC3S400-4FTG256C More Descriptions

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA256
FPGA XC3S400 Family 3584 Logic Units 8064 Cells 1.2V 256-Pin F TBGA
400000 System Gate 1.2 Volt Fpga Rohs Compliant: Yes |Amd Xilinx XC3S400-4FTG256C.
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PQFP144
FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA
Product Description Demo for Development.
French Electronic Distributor since 1988

Certification