XC3S250E-4TQG144I

Xilinx Inc. XC3S250E-4TQG144I

Part Number:
XC3S250E-4TQG144I
Manufacturer:
Xilinx Inc.
Ventron No:
3632578-XC3S250E-4TQG144I
Description:
IC FPGA 108 I/O 144TQFP
ECAD Model:
Datasheet:
XC3S250E-4TQG144I

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Specifications
Xilinx Inc. XC3S250E-4TQG144I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S250E-4TQG144I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Number of Pins
    144
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Spartan®-3E
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S250E
  • Pin Count
    144
  • Number of Outputs
    80
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.32.5V
  • Number of I/O
    108
  • RAM Size
    27kB
  • Clock Frequency
    572MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    5508
  • Total RAM Bits
    221184
  • Number of Gates
    250000
  • Number of LABs/CLBs
    612
  • Speed Grade
    4
  • Number of Registers
    4896
  • Combinatorial Delay of a CLB-Max
    0.76 ns
  • Number of CLBs
    612
  • Height Seated (Max)
    1.6mm
  • Length
    20mm
  • Width
    20mm
  • RoHS Status
    ROHS3 Compliant
Description
XC3S250E-4TQG144I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is packaged in a Tray format and was first released in 2009. The Moisture Sensitivity Level (MSL) is rated at 3, meaning it can withstand exposure to moisture for up to 168 hours without damage. The Terminal Form is GULL WING and it requires a Supply Voltage of 1.2V. The Base Part Number is XC3S250E, and it has a total of 80 outputs and 108 I/O (Input/Output) connections. The chip also has a Total RAM Bits capacity of 221184 and a width of 20mm.

XC3S250E-4TQG144I Features
108 I/Os
Up to 221184 RAM bits
144 LABs/CLBs
4896 registers

XC3S250E-4TQG144I Applications
There are a lot of Xilinx Inc. XC3S250E-4TQG144I FPGAs applications.

Radar and Sensors
Medical ultrasounds
Development Boards and Shields for Microcontrollers
Medical imaging
Cryptography
Industrial,Medical and Scientific Instruments
DO-254
Digital signal processing
Security systems
Aircraft navigation
XC3S250E-4TQG144I More Descriptions
FPGA Spartan-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V 144-Pin TQFP
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100
Product Description Demo for Development.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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