Xilinx Inc. XC3S1000-5FTG256C

XC3S1000-5FTG256C Overview
The mount type for this particular device is surface mount, which means it can be directly mounted onto a circuit board. The packaging for this device is in the form of a tray, which is a convenient way to store and transport multiple units of the device. It was first published in 2006, indicating that it has been available for quite some time. This device belongs to the Spartan®-3 series, which is a family of field-programmable gate arrays (FPGAs) developed by Xilinx. The terminal position for this device is at the bottom, meaning that the terminals or pins are located on the underside of the device. The terminal form is ball, which refers to the shape of the terminals. The supply voltage required for this device is 1.2V. The reflow temperature-max (s) is 30, indicating the maximum temperature that the device can withstand during the reflow soldering process. The RAM size for this device is 54kB, which refers to the amount of random access memory available. Finally, the speed grade for this device is 5, which indicates the maximum operating frequency or speed at which the device can function effectively.

XC3S1000-5FTG256C Features
173 I/Os
Up to 442368 RAM bits
256 LABs/CLBs

XC3S1000-5FTG256C Applications
There are a lot of Xilinx Inc. XC3S1000-5FTG256C FPGAs applications.

Space Applications
Development Boards and Shields for Microcontrollers
Image processing
Artificial intelligence (AI)
Medical ultrasounds
Cryptography
Automation
Industrial IoT
High Performance Computing
Camera time adjustments