Xilinx Inc. XC3S1000-4FG456C

Name: XC3S1000-4FG456C
Brand: Xilinx Inc.
SKU: 5037259-XC3S1000-4FG456C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC3S1000-4FG456C

Manufacturer:: Xilinx Inc.

Ventron No:: 5037259-XC3S1000-4FG456C

Description:: IC FPGA 333 I/O 456FBGA

ECAD Model:

Datasheet:: XC3S1000-4FG456C

Specifications

Xilinx Inc. XC3S1000-4FG456C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S1000-4FG456C.

Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
456-BBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Bulk
Published
2006
Series
Spartan®-3
JESD-609 Code
e0
Pbfree Code
no
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
456
ECCN Code
3A991.D
Terminal Finish
Tin/Lead (Sn63Pb37)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Pin Count
456
Number of Outputs
333
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.32.5V
Number of I/O
333
RAM Size
54kB
Clock Frequency
630MHz
Number of Inputs
333
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
17280
Total RAM Bits
442368
Number of Gates
1000000
Number of LABs/CLBs
1920
Speed Grade
4
Combinatorial Delay of a CLB-Max
0.61 ns
Height Seated (Max)
2.6mm
Length
23mm
Width
23mm
RoHS Status
Non-RoHS Compliant

Description

XC3S1000-4FG456C Overview
The package or case of this product is 456-BBGA, which indicates that it has a ball grid array with 456 balls. It is compliant with the JESD-609 code, which ensures its reliability and quality. The code e0 signifies that it is a RoHS-compliant product, meaning it is free of hazardous substances. The ECCN code 3A991.D indicates that it is eligible for export without a license. The peak reflow temperature for this product is 225 degrees Celsius, ensuring that it can withstand high temperatures during the manufacturing process. With a terminal pitch of 1mm, this product is designed for high-density applications. It is a field programmable gate array with 1920 LABs/CLBs, making it highly versatile and customizable. Its speed grade of 4 and combinatorial delay of 0.61 ns make it a high-performance product. Additionally, its width of 23mm makes it compact and suitable for space-constrained applications.

XC3S1000-4FG456C Features
333 I/Os
Up to 442368 RAM bits

XC3S1000-4FG456C Applications
There are a lot of Xilinx Inc. XC3S1000-4FG456C FPGAs applications.

Medical ultrasounds
ADAS
Aerospace and Defense
Secure Communication
Automotive driver's assistance
Industrial,Medical and Scientific Instruments
Ecosystem
OpenCL
ASIC prototyping
Development Boards and Shields for Microcontrollers

XC3S1000-4FG456C More Descriptions

FPGA Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V 456-Pin F-BGA
Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA456
FPGA - Field Programmable Gate Array 1000000 SYSTEM GATE 1.2 VOLT FPGA
BGA-456 Programmable Logic Device (CPLDs/FPGAs) ROHS
FPGA 1920 CLBS 1000000 GATES 630 MHz PBGA456
Product Description Demo for Development.
French Electronic Distributor since 1988

Certification