Xilinx Inc. XC2VP50-5FF1152C

XC2VP50-5FF1152C Overview
The package or case for this particular product is the 1152-BBGA or FCBGA, which is a type of packaging that is commonly used for bulk packaging. It is designed to meet the JESD-609 Code e0, which ensures high reliability and performance. The ECCN Code for this product is 3A991.D, indicating that it is a controlled item for export. The terminal form is BALL, which allows for easy installation and connection. The peak reflow temperature for this package is 225 degrees Celsius, ensuring that it can withstand high temperatures during the manufacturing process. The terminal pitch is 1mm, providing a compact and efficient design. With an operating supply voltage of 1.5V, this product is suitable for a wide range of applications. The RAM size is 522kB, providing ample space for data storage. The maximum seated height of this package is 3.4mm, making it a compact and space-saving option.

XC2VP50-5FF1152C Features
692 I/Os
Up to 4276224 RAM bits
47232 registers

XC2VP50-5FF1152C Applications
There are a lot of Xilinx Inc. XC2VP50-5FF1152C FPGAs applications.

Medical Applications
ADAS
Artificial intelligence (AI)
Software-defined radio
Radar and Sensors
Automotive
Security systems
Secure Communication
Ecosystem
Data Mining