Xilinx Inc. XC2V6000-4FF1152I
- Part Number:
- XC2V6000-4FF1152I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3133368-XC2V6000-4FF1152I
- Description:
- IC FPGA 824 I/O 1152FCBGA
- Datasheet:
- Virtex-II Platform FPGAs
Xilinx Inc. XC2V6000-4FF1152I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V6000-4FF1152I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1152-BBGA, FCBGA
- Number of Pins1152
- Supplier Device Package1152-CFCBGA (35x35)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesVirtex®-II
- Published2007
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Voltage - Supply1.425V~1.575V
- Base Part NumberXC2V6000
- Operating Supply Voltage1.5V
- Number of I/O824
- RAM Size324kB
- Total RAM Bits2654208
- Number of Gates6000000
- Number of LABs/CLBs8448
- Number of Logic Blocks (LABs)8448
- Speed Grade4
- Number of Registers67584
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
XC2V6000-4FF1152I Overview
This package is included in the 1152-BBGA, FCBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . An FPGA belonging to the Virtex®-II series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 2654208 RAM bits in terms of its RAM si2654208e. Parts related to this part can be found using its base part number XC2V6000. During the configuration of this FPGA module, the RAM si324kBe reaches 324kB to ensure that the program runs normally. The device is designed with 1152 pins in total. An array of 8448 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.5V supply voltage, designers can take full advantage of its flexibility. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 6000000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 8448 logic blocks (LABs), which are called building blocks. A total of 67584 registers are used for storing and transferring data between them. Device package 1152-CFCBGA (35x35) is provided by its supplier.
XC2V6000-4FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
100°C gates
8448 logic blocks (LABs)
67584 registers
XC2V6000-4FF1152I Applications
There are a lot of Xilinx Inc.
XC2V6000-4FF1152I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
This package is included in the 1152-BBGA, FCBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . An FPGA belonging to the Virtex®-II series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 2654208 RAM bits in terms of its RAM si2654208e. Parts related to this part can be found using its base part number XC2V6000. During the configuration of this FPGA module, the RAM si324kBe reaches 324kB to ensure that the program runs normally. The device is designed with 1152 pins in total. An array of 8448 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.5V supply voltage, designers can take full advantage of its flexibility. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 6000000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 8448 logic blocks (LABs), which are called building blocks. A total of 67584 registers are used for storing and transferring data between them. Device package 1152-CFCBGA (35x35) is provided by its supplier.
XC2V6000-4FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
100°C gates
8448 logic blocks (LABs)
67584 registers
XC2V6000-4FF1152I Applications
There are a lot of Xilinx Inc.
XC2V6000-4FF1152I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XC2V6000-4FF1152I More Descriptions
IC FPGA 824 I/O 1152FCBGA
IC FPGA 684 I/O 957FCBGA
OEMs, CMs ONLY (NO BROKERS)
Analog Circuit
IC FPGA 684 I/O 957FCBGA
OEMs, CMs ONLY (NO BROKERS)
Analog Circuit
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