XC2V6000-4FF1152I

Xilinx Inc. XC2V6000-4FF1152I

Part Number:
XC2V6000-4FF1152I
Manufacturer:
Xilinx Inc.
Ventron No:
3133368-XC2V6000-4FF1152I
Description:
IC FPGA 824 I/O 1152FCBGA
ECAD Model:
Datasheet:
Virtex-II Platform FPGAs

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Specifications
Xilinx Inc. XC2V6000-4FF1152I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V6000-4FF1152I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1152-BBGA, FCBGA
  • Number of Pins
    1152
  • Supplier Device Package
    1152-CFCBGA (35x35)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Virtex®-II
  • Published
    2007
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Voltage - Supply
    1.425V~1.575V
  • Base Part Number
    XC2V6000
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    824
  • RAM Size
    324kB
  • Total RAM Bits
    2654208
  • Number of Gates
    6000000
  • Number of LABs/CLBs
    8448
  • Number of Logic Blocks (LABs)
    8448
  • Speed Grade
    4
  • Number of Registers
    67584
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
XC2V6000-4FF1152I Overview
This package is included in the 1152-BBGA, FCBGA package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.425V~1.575V . An FPGA belonging to the Virtex®-II series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 2654208 RAM bits in terms of its RAM si2654208e. Parts related to this part can be found using its base part number XC2V6000. During the configuration of this FPGA module, the RAM si324kBe reaches 324kB to ensure that the program runs normally. The device is designed with 1152 pins in total. An array of 8448 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.5V supply voltage, designers can take full advantage of its flexibility. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 6000000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 8448 logic blocks (LABs), which are called building blocks. A total of 67584 registers are used for storing and transferring data between them. Device package 1152-CFCBGA (35x35) is provided by its supplier.

XC2V6000-4FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
100°C gates
8448 logic blocks (LABs)
67584 registers


XC2V6000-4FF1152I Applications
There are a lot of Xilinx Inc.
XC2V6000-4FF1152I FPGAs applications.


ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XC2V6000-4FF1152I More Descriptions
IC FPGA 824 I/O 1152FCBGA
IC FPGA 684 I/O 957FCBGA
OEMs, CMs ONLY (NO BROKERS)
Analog Circuit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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