XC2V6000-4BFG957I

Xilinx Inc. XC2V6000-4BFG957I

Part Number:
XC2V6000-4BFG957I
Manufacturer:
Xilinx Inc.
Ventron No:
3639426-XC2V6000-4BFG957I
Description:
IC FPGA 684 I/O 957FCBGA
ECAD Model:
Datasheet:
Virtex-II Platform FPGAs

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Specifications
Xilinx Inc. XC2V6000-4BFG957I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V6000-4BFG957I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    957-BBGA, FCBGA
  • Number of Pins
    957
  • Supplier Device Package
    957-FCBGA (40x40)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Virtex®-II
  • Published
    2004
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Voltage - Supply
    1.425V~1.575V
  • Base Part Number
    XC2V6000
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    684
  • RAM Size
    324kB
  • Total RAM Bits
    2654208
  • Number of Gates
    6000000
  • Number of LABs/CLBs
    8448
  • Number of Logic Blocks (LABs)
    8448
  • Speed Grade
    4
  • Number of Registers
    67584
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
XC2V6000-4BFG957I Overview
In the package 957-BBGA, FCBGA, this product is provided. A total of 684 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-II series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 2654208 bfpga electronics s of RAM. XC2V6000 is the base part number that can be used to identify related parts. The RAM si324kBe of this FPGA module reaches 324kB so as to guarantee the normal operation of the program during operation. The device has 957 pins which are included in the design. The FPGA is built as an array of 8448 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This module can reach a maximum operating temperature of 100°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than -40°C. A basic building block for this type of building block consists of 6000000 gates. 8448 logic blocks (LABs) constitute its basic building block. The structure of the registers used to store and transfer data consists of 67584 registers. As a supplier, 957-FCBGA (40x40) is responsible for the package of its devices.

XC2V6000-4BFG957I Features
684 I/Os
Up to 2654208 RAM bits
957 LABs/CLBs
100°C gates
8448 logic blocks (LABs)
67584 registers


XC2V6000-4BFG957I Applications
There are a lot of Xilinx Inc.
XC2V6000-4BFG957I FPGAs applications.


Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center
XC2V6000-4BFG957I More Descriptions
Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 6.6pF 50Volts C0G /-0.1pF
IC FPGA 684 I/O 957FCBGA
Contact for details
Analog Circuit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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