XC2S100-5FGG256C

Xilinx Inc. XC2S100-5FGG256C

Part Number:
XC2S100-5FGG256C
Manufacturer:
Xilinx Inc.
Ventron No:
3632956-XC2S100-5FGG256C
Description:
IC FPGA 176 I/O 256FBGA
ECAD Model:
Datasheet:
XC2S100-5FGG256C

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Specifications
Xilinx Inc. XC2S100-5FGG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2S100-5FGG256C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2004
  • Series
    Spartan®-II
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Subcategory
    Field Programmable Gate Arrays
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2S100
  • Pin Count
    256
  • Number of Outputs
    176
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    2.5V
  • Number of I/O
    176
  • RAM Size
    5kB
  • Clock Frequency
    263MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    2700
  • Total RAM Bits
    40960
  • Number of Gates
    100000
  • Number of LABs/CLBs
    600
  • Speed Grade
    5
  • Combinatorial Delay of a CLB-Max
    0.7 ns
  • Number of CLBs
    600
  • Height Seated (Max)
    2mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
XC2S100-5FGG256C Overview
The specific manufacturer of this component is Xilinx Inc. It falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips, which are programmable integrated circuits used in embedded systems. This particular chip is designed to be mounted on a surface, and has 256 pins for connecting to other components. It is also classified as Pbfree (lead-free) and has a Moisture Sensitivity Level of 3, meaning it can withstand exposure to moisture for up to 168 hours. The chip has 256 terminations and a terminal pitch of 1mm, indicating the distance between each pin. Its base part number is XC2S100 and it has a RAM size of 5kB, meaning it can store up to 5,000 bytes of data. The chip also has a capacity of 100,000 gates, which are logic elements that perform operations on the data. It is important to note that this chip is compliant with the Restriction of Hazardous Substances Directive (RoHS), specifically the third version, meaning it does not contain any hazardous materials.

XC2S100-5FGG256C Features
176 I/Os
Up to 40960 RAM bits
256 LABs/CLBs

XC2S100-5FGG256C Applications
There are a lot of Xilinx Inc. XC2S100-5FGG256C FPGAs applications.

Industrial IoT
Military Temperature
Voice recognition
Data Mining
Device controllers
Computer hardware emulation
Video & Image Processing
Software-defined radios
Server Applications
Solar Energy
XC2S100-5FGG256C More Descriptions
FPGA Spartan-II Family 100K Gates 2700 Cells 263MHz 0.18um Technology 2.5V 256-Pin FBGA
Field Programmable Gate Array, 600 CLBs, 100000 Gates, 263MHz, 2700-Cell, CMOS, PQFP208
FPGA - Field Programmable Gate Array 100000 SYSTEM GATE 2.5 VOLT LOGIC CELL ARRAY
BGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Product Description Demo for Development.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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