XC18V256SO20I

Xilinx Inc. XC18V256SO20I

Part Number:
XC18V256SO20I
Manufacturer:
Xilinx Inc.
Ventron No:
3246634-XC18V256SO20I
Description:
IC PROM SER I-TEMP 3.3V 20-SOIC
ECAD Model:
Datasheet:
XC18V(0z, 256, 512)

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Specifications
Xilinx Inc. XC18V256SO20I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC18V256SO20I.
  • Mounting Type
    Surface Mount
  • Package / Case
    20-SOIC (0.295, 7.50mm Width)
  • Surface Mount
    YES
  • Number of Pins
    20
  • Operating Temperature
    -40°C~85°C
  • Packaging
    Tube
  • Published
    1999
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    20
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • HTS Code
    8542.32.00.71
  • Subcategory
    Flash Memories
  • Technology
    CMOS
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC18V256
  • Pin Count
    20
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Programmable Type
    In System Programmable
  • Memory Size
    256Kb
  • Clock Frequency
    33MHz
  • Supply Current-Max
    0.025mA
  • Organization
    32KX8
  • Memory Width
    8
  • Density
    256 kb
  • Standby Current-Max
    0.01A
  • Access Time (Max)
    15 ns
  • Parallel/Serial
    PARALLEL/SERIAL
  • Memory IC Type
    CONFIGURATION MEMORY
  • Endurance
    10000 Write/Erase Cycles
  • Data Retention Time-Min
    10
  • Height Seated (Max)
    2.65mm
  • Length
    12.8mm
  • Width
    7.5mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XC18V256SO20I Overview
This package is based on a neat 20-SOIC (0.295, 7.50mm Width) package which is used by it.Packaging for Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.FPGA is programmable through In System Programmable.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.Currently, data storage can only store data up to 256Kb bytes.Other related parts can be found by searching "XC18V256".The supply voltage should be 3.3V.Different functions can be assigned to 20 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.An CONFIGURATION MEMORY memory chip.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.A 20 pin is included in it.Data is transmitted in this memory using a PARALLEL/SERIAL process.The memory chip is allowed to operate from a voltage no higher than 0.025mA.As part of the package, the part comes with a set of 20 pins.An IC that can work at 33MHz frequency is a memory IC.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.I think of it as a sort of Flash Memories.

XC18V256SO20I Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.

XC18V256SO20I Applications
There are a lot of Xilinx Inc. XC18V256SO20I applications of configuration proms for FPGAs.

Camcorders
data buffer
printers
Cache memory
supercomputers
networks
networking
hard disk drive (HDD)
personal digital assistants
servers
XC18V256SO20I More Descriptions
Configuration Memory, 64KX8, 15ns, Parallel/serial, CMOS, PQCC20
Conv DC-DC Single Step Down 3.5V to 28V 16-Pin TSSOP-EP
IC PROM SER I-TEMP 3.3V 20-SOIC
IC PROM SRL CONFIG 256K 20-SOIC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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