Xilinx Inc. XC18V256SO20I
- Part Number:
- XC18V256SO20I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246634-XC18V256SO20I
- Description:
- IC PROM SER I-TEMP 3.3V 20-SOIC
- Datasheet:
- XC18V(0z, 256, 512)
Xilinx Inc. XC18V256SO20I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC18V256SO20I.
- Mounting TypeSurface Mount
- Package / Case20-SOIC (0.295, 7.50mm Width)
- Surface MountYES
- Number of Pins20
- Operating Temperature-40°C~85°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations20
- ECCN Code3A991.B.1.A
- Terminal FinishTin/Lead (Sn85Pb15)
- HTS Code8542.32.00.71
- SubcategoryFlash Memories
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC18V256
- Pin Count20
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeIn System Programmable
- Memory Size256Kb
- Clock Frequency33MHz
- Supply Current-Max0.025mA
- Organization32KX8
- Memory Width8
- Density256 kb
- Standby Current-Max0.01A
- Access Time (Max)15 ns
- Parallel/SerialPARALLEL/SERIAL
- Memory IC TypeCONFIGURATION MEMORY
- Endurance10000 Write/Erase Cycles
- Data Retention Time-Min10
- Height Seated (Max)2.65mm
- Length12.8mm
- Width7.5mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC18V256SO20I Overview
This package is based on a neat 20-SOIC (0.295, 7.50mm Width) package which is used by it.Packaging for Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.FPGA is programmable through In System Programmable.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.Currently, data storage can only store data up to 256Kb bytes.Other related parts can be found by searching "XC18V256".The supply voltage should be 3.3V.Different functions can be assigned to 20 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.An CONFIGURATION MEMORY memory chip.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.A 20 pin is included in it.Data is transmitted in this memory using a PARALLEL/SERIAL process.The memory chip is allowed to operate from a voltage no higher than 0.025mA.As part of the package, the part comes with a set of 20 pins.An IC that can work at 33MHz frequency is a memory IC.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.I think of it as a sort of Flash Memories.
XC18V256SO20I Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V256SO20I Applications
There are a lot of Xilinx Inc. XC18V256SO20I applications of configuration proms for FPGAs.
Camcorders
data buffer
printers
Cache memory
supercomputers
networks
networking
hard disk drive (HDD)
personal digital assistants
servers
This package is based on a neat 20-SOIC (0.295, 7.50mm Width) package which is used by it.Packaging for Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.FPGA is programmable through In System Programmable.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.Currently, data storage can only store data up to 256Kb bytes.Other related parts can be found by searching "XC18V256".The supply voltage should be 3.3V.Different functions can be assigned to 20 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.An CONFIGURATION MEMORY memory chip.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.A 20 pin is included in it.Data is transmitted in this memory using a PARALLEL/SERIAL process.The memory chip is allowed to operate from a voltage no higher than 0.025mA.As part of the package, the part comes with a set of 20 pins.An IC that can work at 33MHz frequency is a memory IC.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.I think of it as a sort of Flash Memories.
XC18V256SO20I Features
Operating temperature: -40°C~85°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.
XC18V256SO20I Applications
There are a lot of Xilinx Inc. XC18V256SO20I applications of configuration proms for FPGAs.
Camcorders
data buffer
printers
Cache memory
supercomputers
networks
networking
hard disk drive (HDD)
personal digital assistants
servers
XC18V256SO20I More Descriptions
Configuration Memory, 64KX8, 15ns, Parallel/serial, CMOS, PQCC20
Conv DC-DC Single Step Down 3.5V to 28V 16-Pin TSSOP-EP
IC PROM SER I-TEMP 3.3V 20-SOIC
IC PROM SRL CONFIG 256K 20-SOIC
Conv DC-DC Single Step Down 3.5V to 28V 16-Pin TSSOP-EP
IC PROM SER I-TEMP 3.3V 20-SOIC
IC PROM SRL CONFIG 256K 20-SOIC
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