Xilinx Inc. XC17V04PC20I
- Part Number:
- XC17V04PC20I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246613-XC17V04PC20I
- Description:
- IC PROM SER 4MBIT 3.3V 20-PLCC
- Datasheet:
- XC17V04PC20I
Xilinx Inc. XC17V04PC20I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17V04PC20I.
- Mounting TypeSurface Mount
- Package / Case20-LCC (J-Lead)
- Surface MountYES
- Number of Pins20
- Operating Temperature-40°C~85°C
- PackagingTube
- Published1998
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations20
- ECCN Code3A991.B.1
- Terminal FinishTin/Lead (Sn85Pb15)
- HTS Code8542.32.00.61
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionQUAD
- Terminal FormJ BEND
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17V04
- Pin Count20
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Clock Frequency15MHz
- Supply Current-Max0.015mA
- Organization4MX1
- Output Characteristics3-STATE
- Memory Width1
- Density4 Mb
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.572mm
- Length8.9662mm
- Width8.9662mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17V04PC20I Overview
FPGA uses a nice 20-LCC (J-Lead) package that makes FPGA easy to use.External packaging for the Tube series.An individual who is qualified to operate within the -40°C~85°C domain.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.Other components related to "XC17V04" can also be found by searching the word.In order for it to function, it requires a voltage supply of 3.3V.There are different functions associated with 20 terminations.A maximum voltage of 3.6V can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.Using CONFIGURATION MEMORY memory chips, this is what you get.Reflow soldering should be done at 225°C maximum.20 pins are present.Data is transmitted in this memory using a SERIAL process.The memory chip will not operate at a voltage above 0.015mA.As part of the package, the part comes with a set of 20 pins.Using a 15MHz frequency, this memory IC can work at high speeds.There is a configuration of COMMON for the memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17V04PC20I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17V04PC20I Applications
There are a lot of Xilinx Inc. XC17V04PC20I applications of configuration proms for FPGAs.
printers
embedded logic
telecommunications
workstations,
Camcorders
mainframes
main computer memory
personal computers
cell phones
servers
FPGA uses a nice 20-LCC (J-Lead) package that makes FPGA easy to use.External packaging for the Tube series.An individual who is qualified to operate within the -40°C~85°C domain.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.Other components related to "XC17V04" can also be found by searching the word.In order for it to function, it requires a voltage supply of 3.3V.There are different functions associated with 20 terminations.A maximum voltage of 3.6V can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.Using CONFIGURATION MEMORY memory chips, this is what you get.Reflow soldering should be done at 225°C maximum.20 pins are present.Data is transmitted in this memory using a SERIAL process.The memory chip will not operate at a voltage above 0.015mA.As part of the package, the part comes with a set of 20 pins.Using a 15MHz frequency, this memory IC can work at high speeds.There is a configuration of COMMON for the memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17V04PC20I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17V04PC20I Applications
There are a lot of Xilinx Inc. XC17V04PC20I applications of configuration proms for FPGAs.
printers
embedded logic
telecommunications
workstations,
Camcorders
mainframes
main computer memory
personal computers
cell phones
servers
XC17V04PC20I More Descriptions
XC17V04 Tin/Lead (Sn85Pb15) 3A991.B.1 Tube ics fpga configuration 8.9662mm 0.001A 4Mb 3.3V
Configuration Memory, 4MX1, Serial, CMOS, PQCC44
PROM Parallel/Serial 4M-bit 3.3V 20-Pin PLCC
IC PROM SER 4MBIT 3.3V 20-PLCC
Configuration Memory, 4MX1, Serial, CMOS, PQCC44
PROM Parallel/Serial 4M-bit 3.3V 20-Pin PLCC
IC PROM SER 4MBIT 3.3V 20-PLCC
The three parts on the right have similar specifications to XC17V04PC20I.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthDensityStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreeAdditional FeatureReach Compliance CodeJESD-30 CodeQualification StatusMemory SizeOperating ModeMemory DensityPower SuppliesView Compare
-
XC17V04PC20ISurface Mount20-LCC (J-Lead)YES20-40°C~85°CTube1998e0noObsolete3 (168 Hours)203A991.B.1Tin/Lead (Sn85Pb15)8542.32.00.61CMOS3V~3.6VQUADJ BEND22513.3V1.27mm30XC17V04203.3V3.6V3VOTP15MHz0.015mA4MX13-STATE14 Mb0.001ASERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNoNon-RoHS CompliantContains Lead---------
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20-TIN LEAD-CMOS4.75V~5.25VQUADJ BEND22515V1.27mm30-20-5.25V4.75VOTP--36288X1-1--SERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS Compliant-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASunknownS-PQCC-J20COMMERCIAL36kbSYNCHRONOUS36288 bit-
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99--CMOS3V~3.6VDUAL-22513.3V2.54mm30XC17128EL8-3.6V3VOTP15MHz0.005mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliant-Not Qualified128kbSYNCHRONOUS131072 bit3.3V
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99--CMOS4.5V~5.5VDUALGULL WING22515V1.27mm30XC17128E8-5.5V4.5VOTP15MHz0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliant-Not Qualified128kbSYNCHRONOUS131072 bit5V
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
16 January 2024
AD9361BBCZ RF Transceiver Manufacturer, Characteristics, Applications and Package
Ⅰ. Overview of AD9361BBCZⅡ. Who produced AD9361BBCZ?Ⅲ. Technical parameters of AD9361BBCZⅣ. What are the characteristics of AD9361BBCZ?Ⅴ. Market trend of AD9361BBCZⅥ. Where is AD9361BBCZ used?Ⅶ. How to use... -
16 January 2024
PDIUSBD12 Structure, Pin Configuration, Characteristics and Applications
Ⅰ. Overview of PDIUSBD12Ⅱ. Design of PDIUSBD12Ⅲ. Internal structure of PDIUSBD12Ⅳ. Pin configuration of PDIUSBD12Ⅴ. What are the characteristics of PDIUSBD12?Ⅵ. PDIUSBD12 instructionsⅦ. What are the applications of... -
17 January 2024
MCF5282CVM66 Microcontroller Replacements, Structure, Working Principle and Other Details
Ⅰ. MCF5282CVM66 overviewⅡ. Structure and working principle of MCF5282CVM66Ⅲ. Specifications of MCF5282CVM66Ⅳ. What are the advantages and disadvantages of MCF5282CVM66?Ⅴ. Purpose of MCF5282CVM66Ⅵ. Market trend of MCF5282CVM66Ⅶ. Precautions... -
17 January 2024
DS18B20 Digital Temperature Sensor Structure, Features, Applications and More
Ⅰ. What is DS18B20?Ⅱ. Internal structure of DS18B20Ⅲ. Features of DS18B20 sensorⅣ. How does DS18B20 work?Ⅴ. Symbol, footprint and pin configuration of DS18B20Ⅵ. Driving principle of DS18B20Ⅶ. Where...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.