Xilinx Inc. XC17S50AVOG8C
- Part Number:
- XC17S50AVOG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3729406-XC17S50AVOG8C
- Description:
- IC PROM SERIAL 50K 8-SOIC
- Datasheet:
- XC17S50AVOG8C
Xilinx Inc. XC17S50AVOG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S50AVOG8C.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTray
- Published1999
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S50A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size500kb
- Supply Current-Max0.015mA
- Organization559200X1
- Output Characteristics3-STATE
- Memory Width1
- Density1 Mb
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)1.2mm
- Length4.9mm
- Width3.9mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XC17S50AVOG8C Overview
An interesting 8-SOIC (0.154, 3.90mm Width) package is used.External packaging for the Tray series.In the state of 0°C~70°C, licensed to work.With the help of OTP, it can be programmed.A voltage of 3V~3.6V is applied to it.Mounted in Surface Mount is this memory device.Data storage is limited to 500kb bytes.You can search "XC17S50A" for other related parts.There is a voltage requirement of 3.3V for supplying it with power.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.Using CONFIGURATION MEMORY memory chips, this is what you get.FPGA is recommended that the reflow soldering temperature be maintained at no more than 260 during the process.In this case, it has 8 pins.This memory transmit data in the SERIAL process way.The memory chip will not operate at a voltage above 0.015mA.There is a set of 8 pins included with the part.This memory has a COMMON configuration for its I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S50AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50AVOG8C Applications
There are a lot of Xilinx Inc. XC17S50AVOG8C applications of configuration proms for FPGAs.
embedded logic
eDRAM
servers
multimedia computers
cell phones
telecommunications
main computer memory
printers
networking
graphics card
An interesting 8-SOIC (0.154, 3.90mm Width) package is used.External packaging for the Tray series.In the state of 0°C~70°C, licensed to work.With the help of OTP, it can be programmed.A voltage of 3V~3.6V is applied to it.Mounted in Surface Mount is this memory device.Data storage is limited to 500kb bytes.You can search "XC17S50A" for other related parts.There is a voltage requirement of 3.3V for supplying it with power.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.Using CONFIGURATION MEMORY memory chips, this is what you get.FPGA is recommended that the reflow soldering temperature be maintained at no more than 260 during the process.In this case, it has 8 pins.This memory transmit data in the SERIAL process way.The memory chip will not operate at a voltage above 0.015mA.There is a set of 8 pins included with the part.This memory has a COMMON configuration for its I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.
XC17S50AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50AVOG8C Applications
There are a lot of Xilinx Inc. XC17S50AVOG8C applications of configuration proms for FPGAs.
embedded logic
eDRAM
servers
multimedia computers
cell phones
telecommunications
main computer memory
printers
networking
graphics card
XC17S50AVOG8C More Descriptions
XC17S50A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 500kb 3.3V
Memory Circuit, 559232X1, CMOS, PDIP8
Configuration Memory, 559200X1, Serial, CMOS, PDSO8
PROM Serial 1M-bit 3.3V 8-Pin TSOP
Product Description Demo for Development.
IC PROM SERIAL 3.3V 300K 8-SOIC
Memory Circuit, 559232X1, CMOS, PDIP8
Configuration Memory, 559200X1, Serial, CMOS, PDSO8
PROM Serial 1M-bit 3.3V 8-Pin TSOP
Product Description Demo for Development.
IC PROM SERIAL 3.3V 300K 8-SOIC
The three parts on the right have similar specifications to XC17S50AVOG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOrganizationOutput CharacteristicsMemory WidthDensityStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusAdditional FeaturePower SuppliesVoltageClock FrequencyLead FreeReach Compliance CodeQualification StatusOperating ModeMemory DensityView Compare
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XC17S50AVOG8CSurface Mount8-SOIC (0.154, 3.90mm Width)YES80°C~70°CTray1999e3yesObsolete3 (168 Hours)8EAR99Matte Tin (Sn)CMOS3V~3.6VDUALGULL WING26013.3V1.27mm30XC17S50A83.3V3.6V3VOTP500kb0.015mA559200X13-STATE11 Mb0.001ASERIALCOMMONCONFIGURATION MEMORY1.2mm4.9mm3.9mmNoRoHS Compliant----------
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS4.75V~5.25VDUAL-22515V2.54mm30XC17256E85V--OTP256Kb0.01mA256KX13-STATE1256 kb0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS5V5V15MHzContains Lead----
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS3V~3.6VDUAL-22513.3V2.54mm30XC17128EL8-3.6V3VOTP128kb0.005mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS3.3V-15MHzContains Leadnot_compliantNot QualifiedSYNCHRONOUS131072 bit
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-CMOS4.5V~5.5VDUALGULL WING22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS5V-15MHzContains Leadnot_compliantNot QualifiedSYNCHRONOUS131072 bit
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