Xilinx Inc. XC17S30XLVOG8C

XC17S30XLVOG8C Overview
An interesting 8-SOIC (0.154, 3.90mm Width) package is used.Packing on the outside is Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.With a voltage of 3V~3.6V, it is powered.Surface Mount is the orientation of this memory device.There is a limit of 300kb MB for the amount of data that can be stored.You can search "XC17S30XL" for other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.Different functions are associated with 8 terminations.This memory device can be used with a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.Using MEMORY CIRCUIT memory chips, this is what you get.Reflow soldering should be done at 260°C maximum.In this case, it has 8 pins.The memory chip will not operate at a voltage above 0.005mA.With the part are included 8 pins.An IC that can work at 10MHz frequency is a memory IC.The I/O configuration of the memory is COMMON.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.

XC17S30XLVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30XLVOG8C Applications
There are a lot of Xilinx Inc. XC17S30XLVOG8C applications of configuration proms for FPGAs.

personal computers
nonvolatile BIOS memory
printers
eSRAM
networking
workstations,
mainframes
hard disk drive (HDD)
DVD disk buffer
eDRAM