Xilinx Inc. XC17S30XLPD8I
- Part Number:
- XC17S30XLPD8I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246640-XC17S30XLPD8I
- Description:
- IC PROM PROG I-TEMP 3.3V 8-DIP
- Datasheet:
- XC17S30XLPD8I
Xilinx Inc. XC17S30XLPD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S30XLPD8I.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature-40°C~85°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reach Compliance Codenot_compliant
- Base Part NumberXC17S30XL
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size300kb
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.005mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- I/O TypeCOMMON
- Memory IC TypeMEMORY CIRCUIT
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S30XLPD8I Overview
8-DIP (0.300, 7.62mm) is used in this package.Packaging for Tube.As a qualified employee, I can operate within -40°C~85°C.FPGA is programmable through OTP.The voltage is 3V~3.6V.I have mounted this memory device in Through Hole.Data storage is limited to 300kb bytes.XC17S30XL will give you other related parts.There is a voltage requirement of 3.3V for supplying it with power.Different types of 8 terminations are available with different functions.In order to use this memory device, a maximum voltage of 3.6V should be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.FPGA has pins on the 8 axis.The memory chip operates at a voltage of no more than 0.005mA.As part of the package, the part comes with a set of 8 pins.I would like to mention that this is a memory IC that will be able to work at a 10MHz frequency, so I will mention that.In the memory, the I/O configuration has been set to COMMON.The best power supply to use is a 3.3V power supply, which is highly recommended.
XC17S30XLPD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S30XLPD8I Applications
There are a lot of Xilinx Inc. XC17S30XLPD8I applications of configuration proms for FPGAs.
mainframes
personal computers
networking
networks
servers
Camcorders
telecommunications
eDRAM
personal digital assistants
nonvolatile BIOS memory
8-DIP (0.300, 7.62mm) is used in this package.Packaging for Tube.As a qualified employee, I can operate within -40°C~85°C.FPGA is programmable through OTP.The voltage is 3V~3.6V.I have mounted this memory device in Through Hole.Data storage is limited to 300kb bytes.XC17S30XL will give you other related parts.There is a voltage requirement of 3.3V for supplying it with power.Different types of 8 terminations are available with different functions.In order to use this memory device, a maximum voltage of 3.6V should be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.FPGA has pins on the 8 axis.The memory chip operates at a voltage of no more than 0.005mA.As part of the package, the part comes with a set of 8 pins.I would like to mention that this is a memory IC that will be able to work at a 10MHz frequency, so I will mention that.In the memory, the I/O configuration has been set to COMMON.The best power supply to use is a 3.3V power supply, which is highly recommended.
XC17S30XLPD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S30XLPD8I Applications
There are a lot of Xilinx Inc. XC17S30XLPD8I applications of configuration proms for FPGAs.
mainframes
personal computers
networking
networks
servers
Camcorders
telecommunications
eDRAM
personal digital assistants
nonvolatile BIOS memory
XC17S30XLPD8I More Descriptions
XC17S30XL EAR99 Tube 1999 ics fpga configuration 7.62mm 0.00005A 300kb 3.3V
Memory Circuit, 249168X1, CMOS, PDIP8
IC PROM PROG I-TEMP 3.3V 8-DIP
Memory Circuit, 249168X1, CMOS, PDIP8
IC PROM PROG I-TEMP 3.3V 8-DIP
The three parts on the right have similar specifications to XC17S30XLPD8I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchReach Compliance CodeBase Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeAdditional FeaturePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Operating Supply VoltageOrganizationDensityParallel/SerialRadiation HardeningPbfree CodeTerminal FinishTerminal FormJESD-30 CodeMemory DensityView Compare
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XC17S30XLPD8IThrough Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube1999e0ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL13.3V2.54mmnot_compliantXC17S30XL8Not Qualified3.6V3.3V3VOTP300kbSYNCHRONOUS10MHz0.005mA3-STATE10.00005ACOMMONMEMORY CIRCUIT4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead--------------
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Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL13.3V2.54mm-XC17256EL8-3.6V-3VOTP256Kb-15MHz0.005mA3-STATE10.00005ACOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS225303.3V256KX1256 kbSERIALNo-----
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0Obsolete3 (168 Hours)20-CMOS4.75V~5.25VQUAD15V1.27mmunknown-20COMMERCIAL5.25V-4.75VOTP36kbSYNCHRONOUS---1--CONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS Compliant-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS22530-36288X1-SERIAL-noTIN LEADJ BENDS-PQCC-J2036288 bit
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Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99CMOS4.5V~5.5VDUAL15V2.54mmnot_compliantXC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA3-STATE10.00005ACOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS22530---SERIAL-----131072 bit
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