Xilinx Inc. XC17S200AVOG8I
- Part Number:
- XC17S200AVOG8I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3245627-XC17S200AVOG8I
- Description:
- IC PROM SERIAL 200K 8-SOIC
- Datasheet:
- XC17S200AVOG8I
Xilinx Inc. XC17S200AVOG8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S200AVOG8I.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature-40°C~85°C
- PackagingTray
- Published1999
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S200A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size2Mb
- Supply Current-Max0.015mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)1.2mm
- Length4.9mm
- Width3.9mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XC17S200AVOG8I Overview
This package makes use of the 8-SOIC (0.154, 3.90mm Width) programming language.External packaging for the Tray series.In the state of -40°C~85°C, licensed to work.This device can be programmed using OTP.FPGA is powered by a voltage which is 3V~3.6V volts, and this voltage is the voltage from which the generator is powered.There is a memory device mounted in Surface Mount.There is a limit of 2Mb MB for the amount of data that can be stored.You can search "XC17S200A" for other related parts.3.3V is the voltage it requires as a supply.There are different functions associated with 8 terminations.There is a maximum voltage of 3.6V that can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the CONFIGURATION MEMORY memory chip, we can store data.When soldering in reflow mode, the temperature should be kept below 260 at all times during the soldering process.8 pins are located on the board.SERIAL-process memory transmits data.The memory chip will not operate at a voltage above 0.015mA.Parts come with 8 pins.The memory's I/O is configured as COMMON.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S200AVOG8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200AVOG8I Applications
There are a lot of Xilinx Inc. XC17S200AVOG8I applications of configuration proms for FPGAs.
multimedia computers
cell phones
Camcorders
networks
networking
eSRAM
servers
workstations,
personal computers
telecommunications
This package makes use of the 8-SOIC (0.154, 3.90mm Width) programming language.External packaging for the Tray series.In the state of -40°C~85°C, licensed to work.This device can be programmed using OTP.FPGA is powered by a voltage which is 3V~3.6V volts, and this voltage is the voltage from which the generator is powered.There is a memory device mounted in Surface Mount.There is a limit of 2Mb MB for the amount of data that can be stored.You can search "XC17S200A" for other related parts.3.3V is the voltage it requires as a supply.There are different functions associated with 8 terminations.There is a maximum voltage of 3.6V that can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the CONFIGURATION MEMORY memory chip, we can store data.When soldering in reflow mode, the temperature should be kept below 260 at all times during the soldering process.8 pins are located on the board.SERIAL-process memory transmits data.The memory chip will not operate at a voltage above 0.015mA.Parts come with 8 pins.The memory's I/O is configured as COMMON.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.
XC17S200AVOG8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200AVOG8I Applications
There are a lot of Xilinx Inc. XC17S200AVOG8I applications of configuration proms for FPGAs.
multimedia computers
cell phones
Camcorders
networks
networking
eSRAM
servers
workstations,
personal computers
telecommunications
XC17S200AVOG8I More Descriptions
Configuration Memory, 1335872X1, Serial, CMOS, PDIP8
XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin TSOP
XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin TSOP
The three parts on the right have similar specifications to XC17S200AVOG8I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusAdditional FeatureReach Compliance CodeJESD-30 CodeQualification StatusOperating ModeOrganizationMemory DensityPower SuppliesClock FrequencyLead FreeView Compare
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XC17S200AVOG8ISurface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTray1999e3yesObsolete3 (168 Hours)8EAR99Matte Tin (Sn)CMOS3V~3.6VDUALGULL WING26013.3V1.27mm30XC17S200A83.3V3.6V3VOTP2Mb0.015mA3-STATE10.001ASERIALCOMMONCONFIGURATION MEMORY1.2mm4.9mm3.9mmNoRoHS Compliant-----------
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Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20-TIN LEADCMOS4.75V~5.25VQUADJ BEND22515V1.27mm30-20-5.25V4.75VOTP36kb--1-SERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASunknownS-PQCC-J20COMMERCIALSYNCHRONOUS36288X136288 bit---
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Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-CMOS4.5V~5.5VDUALGULL WING22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliant-Not QualifiedSYNCHRONOUS-131072 bit5V15MHzContains Lead
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Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS4.5V~5.5VDUAL-22515V2.54mm30XC17128E8-5.5V4.5VOTP128kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliant-Not QualifiedSYNCHRONOUS-131072 bit5V15MHzContains Lead
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