Xilinx Inc. XC17S10XLVO8C

XC17S10XLVO8C Overview
There is a neat 8-SOIC (0.154, 3.90mm Width) package that is used in this program.External packaging of type Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.This memory device is mounted in Surface Mount.100kb is the maximum storage size.Other related parts can be found by searching "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.Different types of 8 terminations are available with different functions.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.An operating voltage of 3V is required in order to supply the device.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.Reflow soldering should be done at no higher than 225 degrees.Pins on it are 8-shaped.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts come with 8 pins set.There is a memory IC in this package that works at 10MHz frequencies.There is a configuration of COMMON for the memory's I/O.Using a 3.3V power supply is recommended for best results.

XC17S10XLVO8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLVO8C Applications
There are a lot of Xilinx Inc. XC17S10XLVO8C applications of configuration proms for FPGAs.

DVD disk buffer
workstations,
main computer memory
eDRAM
supercomputers
data buffer
printers
telecommunications
hard disk drive (HDD)
embedded logic