Xilinx Inc. XC17S10XLVO8C
- Part Number:
- XC17S10XLVO8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730495-XC17S10XLVO8C
- Description:
- IC 3V PROM SER 10K 8-SOIC
- Datasheet:
- XC17S10XLVO8C
Xilinx Inc. XC17S10XLVO8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S10XLVO8C.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S10XL
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size100kb
- Operating ModeSYNCHRONOUS
- Clock Frequency10MHz
- Supply Current-Max0.005mA
- Organization95752X1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density95752 bit
- I/O TypeCOMMON
- Memory IC TypeMEMORY CIRCUIT
- Height Seated (Max)1.2mm
- Length4.9mm
- Width3.9mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S10XLVO8C Overview
There is a neat 8-SOIC (0.154, 3.90mm Width) package that is used in this program.External packaging of type Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.This memory device is mounted in Surface Mount.100kb is the maximum storage size.Other related parts can be found by searching "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.Different types of 8 terminations are available with different functions.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.An operating voltage of 3V is required in order to supply the device.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.Reflow soldering should be done at no higher than 225 degrees.Pins on it are 8-shaped.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts come with 8 pins set.There is a memory IC in this package that works at 10MHz frequencies.There is a configuration of COMMON for the memory's I/O.Using a 3.3V power supply is recommended for best results.
XC17S10XLVO8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLVO8C Applications
There are a lot of Xilinx Inc. XC17S10XLVO8C applications of configuration proms for FPGAs.
DVD disk buffer
workstations,
main computer memory
eDRAM
supercomputers
data buffer
printers
telecommunications
hard disk drive (HDD)
embedded logic
There is a neat 8-SOIC (0.154, 3.90mm Width) package that is used in this program.External packaging of type Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.With the help of OTP, it can be programmed.There is a voltage of 3V~3.6V applied to the device.This memory device is mounted in Surface Mount.100kb is the maximum storage size.Other related parts can be found by searching "XC17S10XL".The supply voltage of the device must be 3.3V in order to operate correctly.Different types of 8 terminations are available with different functions.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.An operating voltage of 3V is required in order to supply the device.FPGA is a MEMORY CIRCUIT memory chip that we are talking about here.Reflow soldering should be done at no higher than 225 degrees.Pins on it are 8-shaped.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts come with 8 pins set.There is a memory IC in this package that works at 10MHz frequencies.There is a configuration of COMMON for the memory's I/O.Using a 3.3V power supply is recommended for best results.
XC17S10XLVO8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.
XC17S10XLVO8C Applications
There are a lot of Xilinx Inc. XC17S10XLVO8C applications of configuration proms for FPGAs.
DVD disk buffer
workstations,
main computer memory
eDRAM
supercomputers
data buffer
printers
telecommunications
hard disk drive (HDD)
embedded logic
XC17S10XLVO8C More Descriptions
Configuration Memory, 1040096X1, Serial, CMOS, PDIP8
XC17S10XL EAR99 Tube 95752X1 ics fpga configuration 3.9mm 0.00005A 100kb 3.3V
SPECIALTY MEMORY CIRCUIT PDSO8
IC PROM PROG I-TEMP 3.3V 8-DIP
XC17S10XL EAR99 Tube 95752X1 ics fpga configuration 3.9mm 0.00005A 100kb 3.3V
SPECIALTY MEMORY CIRCUIT PDSO8
IC PROM PROG I-TEMP 3.3V 8-DIP
The three parts on the right have similar specifications to XC17S10XLVO8C.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeAdditional FeatureParallel/SerialView Compare
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XC17S10XLVO8CSurface Mount8-SOIC (0.154, 3.90mm Width)YES80°C~70°CTube1999e0noObsolete1 (Unlimited)8EAR99CMOS3V~3.6VDUALGULL WING22513.3V1.27mmnot_compliant30XC17S10XL8Not Qualified3.6V3.3V3VOTP100kbSYNCHRONOUS10MHz0.005mA95752X13-STATE10.00005A95752 bitCOMMONMEMORY CIRCUIT1.2mm4.9mm3.9mmNon-RoHS CompliantContains Lead---
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL-22513.3V2.54mmnot_compliant30XC1701L8Not Qualified3.6V3.3V3VOTP1MbSYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A-COMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIAL
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL-22513.3V2.54mmnot_compliant30XC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIAL
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS4.5V~5.5VDUAL-22515V2.54mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASSERIAL
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