Xilinx Inc. XC17S100AVOG8C

Name: XC17S100AVOG8C
Brand: Xilinx Inc.
SKU: 3245654-XC17S100AVOG8C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC17S100AVOG8C

Manufacturer:: Xilinx Inc.

Ventron No:: 3245654-XC17S100AVOG8C

Description:: IC PROM SERIAL 100K 8-SOIC

ECAD Model:

Datasheet:: XC17S100AVOG8C

Specifications

Xilinx Inc. XC17S100AVOG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S100AVOG8C.

Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
0°C~70°C
Packaging
Tray
Published
1999
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN Code
3A991.B.1
Voltage - Supply
3V~3.6V
Base Part Number
XC17S100A
Pin Count
8
Operating Supply Voltage
3.3V
Programmable Type
OTP
Density
1 Mb
Radiation Hardening
No
RoHS Status
RoHS Compliant

Description

XC17S100AVOG8C Overview
FPGA uses a neat 8-SOIC (0.154, 3.90mm Width) package.External packaging of type Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.The OTP programming language can be used to program it.This device is fed with a voltage of 3V~3.6V which is applied to it.The memory device is mounted in Surface Mount.XC17S100A will give you other related parts.FPGA has pins on the 8 axis.As part of the package, the part comes with a set of 8 pins.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.

XC17S100AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.

XC17S100AVOG8C Applications
There are a lot of Xilinx Inc. XC17S100AVOG8C applications of configuration proms for FPGAs.

graphics card
eDRAM
personal computers
cell phones
printers
data buffer
eSRAM
workstations,
networks
embedded logic

XC17S100AVOG8C More Descriptions

Memory Circuit, 781248X1, CMOS, PDIP8
PROM Serial 1M-bit 3.3V 8-Pin TSOP
IC SYNC PWM SWITCHER 20-HTSSOP

Product Comparison

The three parts on the right have similar specifications to XC17S100AVOG8C.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

ECCN Code

Voltage - Supply

Base Part Number

Pin Count

Operating Supply Voltage

Programmable Type

Density

Radiation Hardening

RoHS Status

Surface Mount

JESD-609 Code

Number of Terminations

Additional Feature

Technology

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Memory Size

Clock Frequency

Supply Current-Max

Organization

Output Characteristics

Memory Width

Standby Current-Max

Parallel/Serial

I/O Type

Memory IC Type

Height Seated (Max)

Length

Width

Lead Free

Reach Compliance Code

Qualification Status

Power Supplies

Operating Mode

Voltage

View Compare
XC17S100AVOG8C

Xilinx Inc.

Surface Mount

8-SOIC (0.154, 3.90mm Width)

8

0°C~70°C

Tray

1999

yes

Obsolete

3 (168 Hours)

3A991.B.1

3V~3.6V

XC17S100A

8

3.3V

OTP

1 Mb

No

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC17256ELPD8I

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

8

-40°C~85°C

Tube

2000

-

Obsolete

Not Applicable

EAR99

3V~3.6V

XC17256EL

8

3.3V

OTP

256 kb

No

Non-RoHS Compliant

NO

e0

8

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

DUAL

225

1

3.3V

2.54mm

30

3.6V

3V

256Kb

15MHz

0.005mA

256KX1

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

Contains Lead

-

-

-

-

-

XC17S100AVOG8C vs XC17256ELPD8I
XC1701LPD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

8

0°C~70°C

Tube

2000

no

Obsolete

Not Applicable

EAR99

3V~3.6V

XC1701L

8

-

OTP

-

-

Non-RoHS Compliant

NO

e0

8

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

DUAL

225

1

3.3V

2.54mm

30

3.6V

3V

1Mb

15MHz

0.01mA

1MX1

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

Contains Lead

not_compliant

Not Qualified

3.3V

SYNCHRONOUS

-

XC17S100AVOG8C vs XC1701LPD8C
XC17256EPD8C

Xilinx Inc.

Through Hole

8-DIP (0.300, 7.62mm)

8

0°C~70°C

Tube

2000

-

Obsolete

Not Applicable

EAR99

4.75V~5.25V

XC17256E

8

5V

OTP

256 kb

No

Non-RoHS Compliant

NO

e0

8

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CMOS

DUAL

225

1

5V

2.54mm

30

-

-

256Kb

15MHz

0.01mA

256KX1

3-STATE

1

0.00005A

SERIAL

COMMON

CONFIGURATION MEMORY

4.5974mm

9.3599mm

7.62mm

Contains Lead

-

-

5V

-

5V

XC17S100AVOG8C vs XC17256EPD8C