Xilinx Inc. XC1765ELPD8C
- Part Number:
- XC1765ELPD8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3246566-XC1765ELPD8C
- Description:
- IC PROM SER C-TEMP 3.3V 8-DIP
- Datasheet:
- XC1765ELPD8C
Xilinx Inc. XC1765ELPD8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC1765ELPD8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published2000
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC1765EL
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size65kb
- Operating ModeSYNCHRONOUS
- Clock Frequency2.5MHz
- Supply Current-Max0.005mA
- Organization64KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density65536 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC1765ELPD8C Overview
Xilinx Inc. is the brand of this part, which falls under the Memory - Configuration Proms for FPGAs category. This chip has 8 pins and utilizes CMOS technology. Its peak reflow temperature is 225 degrees Celsius and it has 1 function. Currently, it is not qualified for use. The supply voltage-minimum is 3V and it has a memory size of 65kb. The output characteristics are 3-STATE and the memory width is 1. The overall width of the chip is 7.62mm.
XC1765ELPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765ELPD8C Applications
There are a lot of Xilinx Inc. XC1765ELPD8C applications of configuration proms for FPGAs.
graphics card
main computer memory
mainframes
Cache memory
telecommunications
personal computers
cell phones
personal digital assistants
hard disk drive (HDD)
data buffer
Xilinx Inc. is the brand of this part, which falls under the Memory - Configuration Proms for FPGAs category. This chip has 8 pins and utilizes CMOS technology. Its peak reflow temperature is 225 degrees Celsius and it has 1 function. Currently, it is not qualified for use. The supply voltage-minimum is 3V and it has a memory size of 65kb. The output characteristics are 3-STATE and the memory width is 1. The overall width of the chip is 7.62mm.
XC1765ELPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1765ELPD8C Applications
There are a lot of Xilinx Inc. XC1765ELPD8C applications of configuration proms for FPGAs.
graphics card
main computer memory
mainframes
Cache memory
telecommunications
personal computers
cell phones
personal digital assistants
hard disk drive (HDD)
data buffer
XC1765ELPD8C More Descriptions
XC1765EL EAR99 Tube 64KX1 ics fpga configuration 7.62mm 0.00005A 65kb 3.3V
Configuration Memory, 64KX1, Serial, CMOS, PDSO8
64K X 1 CONFIGURATION MEMORY PDIP8
PROM Serial 64K-bit 3.3V 8-Pin PDIP
IC PROM SER I-TEMP 3.3V 20-PLCC
Configuration Memory, 64KX1, Serial, CMOS, PDSO8
64K X 1 CONFIGURATION MEMORY PDIP8
PROM Serial 64K-bit 3.3V 8-Pin PDIP
IC PROM SER I-TEMP 3.3V 20-PLCC
The three parts on the right have similar specifications to XC1765ELPD8C.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreePbfree CodeTerminal FormView Compare
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XC1765ELPD8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0ObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC1765EL8Not Qualified3.6V3.3V3VOTP65kbSYNCHRONOUS2.5MHz0.005mA64KX13-STATE10.00005A65536 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead---
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0ObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC1701L8Not Qualified3.6V3.3V3VOTP1MbSYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Leadno-
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VDUAL22513.3V2.54mmnot_compliant30XC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead--
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0Obsolete1 (Unlimited)8EAR99USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUAL22515V1.27mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mmNon-RoHS CompliantContains Lead-GULL WING
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