XC17512LPD8I

Xilinx Inc. XC17512LPD8I

Part Number:
XC17512LPD8I
Manufacturer:
Xilinx Inc.
Ventron No:
3246540-XC17512LPD8I
Description:
IC PROM SER I-TEMP 512K 8-DIP
ECAD Model:
Datasheet:
XC17512LPD8I

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Specifications
Xilinx Inc. XC17512LPD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17512LPD8I.
  • Mounting Type
    Through Hole
  • Package / Case
    8-DIP (0.300, 7.62mm)
  • Surface Mount
    NO
  • Number of Pins
    8
  • Operating Temperature
    -40°C~85°C
  • Packaging
    Tube
  • Published
    2000
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Additional Feature
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
    CMOS
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    2.54mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC17512L
  • Pin Count
    8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3V
  • Programmable Type
    OTP
  • Memory Size
    512kb
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    15MHz
  • Supply Current-Max
    0.005mA
  • Organization
    512KX1
  • Output Characteristics
    3-STATE
  • Memory Width
    1
  • Standby Current-Max
    0.00005A
  • Parallel/Serial
    SERIAL
  • I/O Type
    COMMON
  • Memory IC Type
    CONFIGURATION MEMORY
  • Height Seated (Max)
    4.5974mm
  • Length
    9.3599mm
  • Width
    7.62mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XC17512LPD8I Overview
This package makes use of the 8-DIP (0.300, 7.62mm) programming language.Packaging for the external use of Tube.A qualified individual who has the ability to operate within -40°C~85°C.This device can be programmed using OTP.FPGA is fed wFPGAh a voltage of 3V~3.6V.I have mounted this memory device in Through Hole.A maximum of 512kb bytes of data can be stored.To find other similar parts, search for "XC17512L".3.3V is the required supply voltage.There are different functions that can be applied on the 8 axis when it comes to terminating.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.Using CONFIGURATION MEMORY memory chips, this is what you get.Reflow soldering should be done at no higher than 225 degrees.FPGA is equipped wFPGAh 8 pins.Through SERIAL-processing, data is transmitted from this memory to the CPU.Memory chips can operate at a voltage no higher than 0.005mA.There is a set of 8 pins that are included with the part.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.In the memory, the I/O configuration has been set to COMMON.A power supply that is rated at 3.3V is recommended for use with this product.Our product line now includes USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS in order to provide a better level of service to our customers.

XC17512LPD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17512LPD8I Applications
There are a lot of Xilinx Inc. XC17512LPD8I applications of configuration proms for FPGAs.

networks
multimedia computers
personal digital assistants
servers
workstations,
main computer memory
DVD disk buffer
hard disk drive (HDD)
personal computers
cell phones
XC17512LPD8I More Descriptions
XC17512L EAR99 Tube 512KX1 ics fpga configuration 7.62mm 0.00005A 512kb 3.3V
Configuration Memory, 512KX1, Serial, CMOS, PDSO20
IC PROM SER I-TEMP 512K 8-DIP
OEMs, CMs ONLY (NO BROKERS)
Product Comparison
The three parts on the right have similar specifications to XC17512LPD8I.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Programmable Type
    Memory Size
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Organization
    Output Characteristics
    Memory Width
    Standby Current-Max
    Parallel/Serial
    I/O Type
    Memory IC Type
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Operating Supply Voltage
    Voltage
    Density
    Radiation Hardening
    Terminal Form
    Memory Density
    View Compare
  • XC17512LPD8I
    XC17512LPD8I
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    -40°C~85°C
    Tube
    2000
    e0
    no
    Obsolete
    Not Applicable
    8
    EAR99
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    not_compliant
    30
    XC17512L
    8
    Not Qualified
    3.6V
    3.3V
    3V
    OTP
    512kb
    SYNCHRONOUS
    15MHz
    0.005mA
    512KX1
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
  • XC1701LPD8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2000
    e0
    no
    Obsolete
    Not Applicable
    8
    EAR99
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    3V~3.6V
    DUAL
    225
    1
    3.3V
    2.54mm
    not_compliant
    30
    XC1701L
    8
    Not Qualified
    3.6V
    3.3V
    3V
    OTP
    1Mb
    SYNCHRONOUS
    15MHz
    0.01mA
    1MX1
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
  • XC17256EPD8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    DUAL
    225
    1
    5V
    2.54mm
    -
    30
    XC17256E
    8
    -
    -
    5V
    -
    OTP
    256Kb
    -
    15MHz
    0.01mA
    256KX1
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    Contains Lead
    5V
    5V
    256 kb
    No
    -
    -
  • XC17128EVO8I
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    YES
    8
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    1 (Unlimited)
    8
    EAR99
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.5V~5.5V
    DUAL
    225
    1
    5V
    1.27mm
    not_compliant
    30
    XC17128E
    8
    Not Qualified
    5.5V
    5V
    4.5V
    OTP
    128kb
    SYNCHRONOUS
    15MHz
    0.01mA
    -
    3-STATE
    1
    0.00005A
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    -
    4.9276mm
    3.937mm
    Non-RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    GULL WING
    131072 bit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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