Xilinx Inc. XC17256EPCG20C
- Part Number:
- XC17256EPCG20C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3245659-XC17256EPCG20C
- Description:
- IC PROM SERIAL 256K 20-PLCC
- Datasheet:
- XC17256EPCG20C
Xilinx Inc. XC17256EPCG20C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17256EPCG20C.
- Mounting TypeSurface Mount
- Package / Case20-LCC (J-Lead)
- Surface MountYES
- Number of Pins20
- Operating Temperature0°C~70°C
- PackagingTray
- Published2004
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations20
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- HTS Code8542.32.00.61
- TechnologyCMOS
- Voltage - Supply4.75V~5.25V
- Terminal PositionQUAD
- Terminal FormJ BEND
- Peak Reflow Temperature (Cel)245
- Number of Functions1
- Supply Voltage5V
- Terminal Pitch1.27mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)30
- Base Part NumberXC17256E
- Pin Count20
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)5.25V
- Power Supplies5V
- Supply Voltage-Min (Vsup)4.75V
- Programmable TypeOTP
- Memory Size256Kb
- Operating ModeSYNCHRONOUS
- Clock Frequency15MHz
- Supply Current-Max0.01mA
- Organization256KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density262144 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.572mm
- Length8.9662mm
- Width8.9662mm
- RoHS StatusRoHS Compliant
XC17256EPCG20C Overview
An interesting 20-LCC (J-Lead) package is used.Packing on the outside is Tray.Qualified to operate within 0°C~70°C.Using OTP, you can program it.FPGA is fed wFPGAh a voltage of 4.75V~5.25V.This memory device is mounted in Surface Mount.FPGA is limFPGAed to 256Kb bytes for the size of the data storage.You can search "XC17256E" for other related parts.5V is the required supply voltage.A termination with different functions in the 20 axis.In order to use this memory device, a maximum voltage of 5.25V should be used.If the device needs to be supplied with power, then a minimum voltage of 4.75V is required.An CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 245 when soldering should be reflowed.Pins on it are 20-shaped.With the help of SERIAL-processing, data is sent through this memory.For the memory chip to operate, it requires a voltage not exceeding 0.01mA.As part of the package, the part comes with a set of 20 pins.When it comes to speed, this is a memory IC that can work at a frequency of 15MHz, which is very fast.Memory is configured as COMMON for memory's I/O.The use of 5V power supplies is recommended.Memory features USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS to better serve the need.
XC17256EPCG20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256EPCG20C Applications
There are a lot of Xilinx Inc. XC17256EPCG20C applications of configuration proms for FPGAs.
eSRAM
networking
embedded logic
nonvolatile BIOS memory
Camcorders
workstations,
telecommunications
eDRAM
mainframes
personal computers
An interesting 20-LCC (J-Lead) package is used.Packing on the outside is Tray.Qualified to operate within 0°C~70°C.Using OTP, you can program it.FPGA is fed wFPGAh a voltage of 4.75V~5.25V.This memory device is mounted in Surface Mount.FPGA is limFPGAed to 256Kb bytes for the size of the data storage.You can search "XC17256E" for other related parts.5V is the required supply voltage.A termination with different functions in the 20 axis.In order to use this memory device, a maximum voltage of 5.25V should be used.If the device needs to be supplied with power, then a minimum voltage of 4.75V is required.An CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 245 when soldering should be reflowed.Pins on it are 20-shaped.With the help of SERIAL-processing, data is sent through this memory.For the memory chip to operate, it requires a voltage not exceeding 0.01mA.As part of the package, the part comes with a set of 20 pins.When it comes to speed, this is a memory IC that can work at a frequency of 15MHz, which is very fast.Memory is configured as COMMON for memory's I/O.The use of 5V power supplies is recommended.Memory features USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS to better serve the need.
XC17256EPCG20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256EPCG20C Applications
There are a lot of Xilinx Inc. XC17256EPCG20C applications of configuration proms for FPGAs.
eSRAM
networking
embedded logic
nonvolatile BIOS memory
Camcorders
workstations,
telecommunications
eDRAM
mainframes
personal computers
XC17256EPCG20C More Descriptions
Configuration Memory, 256KX1, Serial, CMOS, PDIP8
Conv DC-DC Single-OUT Step Down 2.7V to 5.5V 6-Pin SC70 Cut Tape
IC PROM SERIAL 128K 8-SOIC
IC PROM SERIAL 256K 20-PLCC
Conv DC-DC Single-OUT Step Down 2.7V to 5.5V 6-Pin SC70 Cut Tape
IC PROM SERIAL 128K 8-SOIC
IC PROM SERIAL 256K 20-PLCC
The three parts on the right have similar specifications to XC17256EPCG20C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusOperating Supply VoltageVoltageDensityRadiation HardeningLead FreeView Compare
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XC17256EPCG20CSurface Mount20-LCC (J-Lead)YES200°C~70°CTray2004e3yesObsolete3 (168 Hours)20EAR99Matte Tin (Sn)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS8542.32.00.61CMOS4.75V~5.25VQUADJ BEND24515V1.27mmunknown30XC17256E20Not Qualified5.25V5V4.75VOTP256KbSYNCHRONOUS15MHz0.01mA256KX13-STATE10.00005A262144 bitSERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mmRoHS Compliant------
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS4.75V~5.25VDUAL-22515V2.54mm-30XC17256E8--5V-OTP256Kb-15MHz0.01mA256KX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant5V5V256 kbNoContains Lead
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS3V~3.6VDUAL-22513.3V2.54mmnot_compliant30XC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant----Contains Lead
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS4.5V~5.5VDUALGULL WING22515V1.27mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mmNon-RoHS Compliant----Contains Lead
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