XC17128EPDG8C

Xilinx Inc. XC17128EPDG8C

Part Number:
XC17128EPDG8C
Manufacturer:
Xilinx Inc.
Ventron No:
3729469-XC17128EPDG8C
Description:
IC PROM SERIAL 128K 8-DIP
ECAD Model:
Datasheet:
XC17128EPDG8C

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Specifications
Xilinx Inc. XC17128EPDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17128EPDG8C.
  • Mounting Type
    Through Hole
  • Package / Case
    8-DIP (0.300, 7.62mm)
  • Surface Mount
    NO
  • Number of Pins
    8
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tube
  • Published
    2004
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
    CMOS
  • Voltage - Supply
    4.75V~5.25V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    250
  • Number of Functions
    1
  • Supply Voltage
    5V
  • Terminal Pitch
    2.54mm
  • Reach Compliance Code
    unknown
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC17128E
  • Pin Count
    8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.25V
  • Power Supplies
    5V
  • Supply Voltage-Min (Vsup)
    4.75V
  • Programmable Type
    OTP
  • Memory Size
    128kb
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    15MHz
  • Supply Current-Max
    0.01mA
  • Output Characteristics
    3-STATE
  • Memory Width
    1
  • Standby Current-Max
    0.00005A
  • Memory Density
    131072 bit
  • Parallel/Serial
    SERIAL
  • I/O Type
    COMMON
  • Memory IC Type
    CONFIGURATION MEMORY
  • Height Seated (Max)
    4.5974mm
  • Length
    9.3599mm
  • Width
    7.62mm
  • RoHS Status
    RoHS Compliant
Description
XC17128EPDG8C Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packing on the outside is Tube.Licensed to operate in 0°C~70°C.OTP is the program that allows it to be programmed.This device is fed with a voltage of 4.75V~5.25V which is applied to it.I have mounted this memory device in Through Hole.There is a limit of 128kb MB for the amount of data that can be stored.To find other similar parts, search for "XC17128E".There is a voltage requirement of 5V for supplying it with power.8 terminations with different functions.5.25V is the maximum voltage that can be used with this memory device.An operating voltage of 4.75V is required in order to supply the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.In reflow soldering, the temperature should be controlled to a maximum of 250 degrees during the process.Pins on it are 8-shaped.In this memory, data is transmitted using the SERIAL process.A memory chip can operate at a voltage no greater than 0.01mA.Parts include 8 pins.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.There is a configuration of COMMON for the memory's I/O.A power supply that is rated at 5V is recommended for use with this product.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.

XC17128EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17128EPDG8C Applications
There are a lot of Xilinx Inc. XC17128EPDG8C applications of configuration proms for FPGAs.

workstations,
telecommunications
cell phones
supercomputers
hard disk drive (HDD)
networking
eDRAM
Camcorders
eSRAM
networks
XC17128EPDG8C More Descriptions
XC17128E Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.00005A 128kb 5V
Configuration Memory, 128KX1, Serial, CMOS, PDIP8
IC PROM SER CONFIG 1M 3.3V 8-DIP
Product Comparison
The three parts on the right have similar specifications to XC17128EPDG8C.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Programmable Type
    Memory Size
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Output Characteristics
    Memory Width
    Standby Current-Max
    Memory Density
    Parallel/Serial
    I/O Type
    Memory IC Type
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Terminal Form
    JESD-30 Code
    Organization
    Operating Supply Voltage
    Voltage
    Density
    Radiation Hardening
    Lead Free
    View Compare
  • XC17128EPDG8C
    XC17128EPDG8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2004
    e3
    yes
    Obsolete
    1 (Unlimited)
    8
    EAR99
    Matte Tin (Sn)
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    DUAL
    250
    1
    5V
    2.54mm
    unknown
    30
    XC17128E
    8
    Not Qualified
    5.25V
    5V
    4.75V
    OTP
    128kb
    SYNCHRONOUS
    15MHz
    0.01mA
    3-STATE
    1
    0.00005A
    131072 bit
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC1736EPC20C
    Surface Mount
    20-LCC (J-Lead)
    YES
    -
    0°C~70°C
    Tube
    -
    e0
    no
    Obsolete
    3 (168 Hours)
    20
    -
    TIN LEAD
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    QUAD
    225
    1
    5V
    1.27mm
    unknown
    30
    -
    20
    COMMERCIAL
    5.25V
    -
    4.75V
    OTP
    36kb
    SYNCHRONOUS
    -
    -
    -
    1
    -
    36288 bit
    SERIAL
    -
    CONFIGURATION MEMORY
    4.572mm
    8.9662mm
    8.9662mm
    Non-RoHS Compliant
    J BEND
    S-PQCC-J20
    36288X1
    -
    -
    -
    -
    -
  • XC17256EPD8C
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    0°C~70°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    -
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.75V~5.25V
    DUAL
    225
    1
    5V
    2.54mm
    -
    30
    XC17256E
    8
    -
    -
    5V
    -
    OTP
    256Kb
    -
    15MHz
    0.01mA
    3-STATE
    1
    0.00005A
    -
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    -
    -
    256KX1
    5V
    5V
    256 kb
    No
    Contains Lead
  • XC17128EPD8I
    Through Hole
    8-DIP (0.300, 7.62mm)
    NO
    8
    -40°C~85°C
    Tube
    2000
    e0
    -
    Obsolete
    Not Applicable
    8
    EAR99
    -
    USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
    CMOS
    4.5V~5.5V
    DUAL
    225
    1
    5V
    2.54mm
    not_compliant
    30
    XC17128E
    8
    Not Qualified
    5.5V
    5V
    4.5V
    OTP
    128kb
    SYNCHRONOUS
    15MHz
    0.01mA
    3-STATE
    1
    0.00005A
    131072 bit
    SERIAL
    COMMON
    CONFIGURATION MEMORY
    4.5974mm
    9.3599mm
    7.62mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    Contains Lead
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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