Xilinx Inc. XC17128EPDG8C
- Part Number:
- XC17128EPDG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3729469-XC17128EPDG8C
- Description:
- IC PROM SERIAL 128K 8-DIP
- Datasheet:
- XC17128EPDG8C
Xilinx Inc. XC17128EPDG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17128EPDG8C.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTube
- Published2004
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply4.75V~5.25V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)250
- Number of Functions1
- Supply Voltage5V
- Terminal Pitch2.54mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)30
- Base Part NumberXC17128E
- Pin Count8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)5.25V
- Power Supplies5V
- Supply Voltage-Min (Vsup)4.75V
- Programmable TypeOTP
- Memory Size128kb
- Operating ModeSYNCHRONOUS
- Clock Frequency15MHz
- Supply Current-Max0.01mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density131072 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- RoHS StatusRoHS Compliant
XC17128EPDG8C Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packing on the outside is Tube.Licensed to operate in 0°C~70°C.OTP is the program that allows it to be programmed.This device is fed with a voltage of 4.75V~5.25V which is applied to it.I have mounted this memory device in Through Hole.There is a limit of 128kb MB for the amount of data that can be stored.To find other similar parts, search for "XC17128E".There is a voltage requirement of 5V for supplying it with power.8 terminations with different functions.5.25V is the maximum voltage that can be used with this memory device.An operating voltage of 4.75V is required in order to supply the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.In reflow soldering, the temperature should be controlled to a maximum of 250 degrees during the process.Pins on it are 8-shaped.In this memory, data is transmitted using the SERIAL process.A memory chip can operate at a voltage no greater than 0.01mA.Parts include 8 pins.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.There is a configuration of COMMON for the memory's I/O.A power supply that is rated at 5V is recommended for use with this product.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.
XC17128EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17128EPDG8C Applications
There are a lot of Xilinx Inc. XC17128EPDG8C applications of configuration proms for FPGAs.
workstations,
telecommunications
cell phones
supercomputers
hard disk drive (HDD)
networking
eDRAM
Camcorders
eSRAM
networks
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packing on the outside is Tube.Licensed to operate in 0°C~70°C.OTP is the program that allows it to be programmed.This device is fed with a voltage of 4.75V~5.25V which is applied to it.I have mounted this memory device in Through Hole.There is a limit of 128kb MB for the amount of data that can be stored.To find other similar parts, search for "XC17128E".There is a voltage requirement of 5V for supplying it with power.8 terminations with different functions.5.25V is the maximum voltage that can be used with this memory device.An operating voltage of 4.75V is required in order to supply the device.The memory chip in question is a CONFIGURATION MEMORY memory chip.In reflow soldering, the temperature should be controlled to a maximum of 250 degrees during the process.Pins on it are 8-shaped.In this memory, data is transmitted using the SERIAL process.A memory chip can operate at a voltage no greater than 0.01mA.Parts include 8 pins.Speaking of speed, this is a memory IC that can work at a 15MHz frequency.There is a configuration of COMMON for the memory's I/O.A power supply that is rated at 5V is recommended for use with this product.The inclusion of USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS will help customers better meet their needs.
XC17128EPDG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17128EPDG8C Applications
There are a lot of Xilinx Inc. XC17128EPDG8C applications of configuration proms for FPGAs.
workstations,
telecommunications
cell phones
supercomputers
hard disk drive (HDD)
networking
eDRAM
Camcorders
eSRAM
networks
XC17128EPDG8C More Descriptions
XC17128E Matte Tin (Sn) EAR99 Tube ics fpga configuration 7.62mm 0.00005A 128kb 5V
Configuration Memory, 128KX1, Serial, CMOS, PDIP8
IC PROM SER CONFIG 1M 3.3V 8-DIP
Configuration Memory, 128KX1, Serial, CMOS, PDIP8
IC PROM SER CONFIG 1M 3.3V 8-DIP
The three parts on the right have similar specifications to XC17128EPDG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusTerminal FormJESD-30 CodeOrganizationOperating Supply VoltageVoltageDensityRadiation HardeningLead FreeView Compare
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XC17128EPDG8CThrough Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2004e3yesObsolete1 (Unlimited)8EAR99Matte Tin (Sn)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL25015V2.54mmunknown30XC17128E8Not Qualified5.25V5V4.75VOTP128kbSYNCHRONOUS15MHz0.01mA3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmRoHS Compliant---------
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20-TIN LEADUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VQUAD22515V1.27mmunknown30-20COMMERCIAL5.25V-4.75VOTP36kbSYNCHRONOUS---1-36288 bitSERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS CompliantJ BENDS-PQCC-J2036288X1-----
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL22515V2.54mm-30XC17256E8--5V-OTP256Kb-15MHz0.01mA3-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant--256KX15V5V256 kbNoContains Lead
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUAL22515V2.54mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant-------Contains Lead
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