Xilinx Inc. XC1701LPCG20C
- Part Number:
- XC1701LPCG20C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3245642-XC1701LPCG20C
- Description:
- IC PROM SERIAL 1K 20-PLCC
- Datasheet:
- XC1701LPCG20C
Xilinx Inc. XC1701LPCG20C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC1701LPCG20C.
- Mounting TypeSurface Mount
- Package / Case20-LCC (J-Lead)
- Surface MountYES
- Number of Pins20
- Operating Temperature0°C~70°C
- PackagingTray
- Published2004
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations20
- Terminal FinishMatte Tin (Sn)
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionQUAD
- Terminal FormJ BEND
- Peak Reflow Temperature (Cel)245
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC1701L
- Pin Count20
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size1Mb
- Operating ModeSYNCHRONOUS
- Clock Frequency15MHz
- Supply Current-Max0.01mA
- Organization1MX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density1048576 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.572mm
- Length8.9662mm
- Width8.9662mm
- RoHS StatusRoHS Compliant
XC1701LPCG20C Overview
An interesting 20-LCC (J-Lead) package is used for this.The external packaging of Tray is made of Tray plastic.As a qualified employee, I can operate within 0°C~70°C.Through OTP, it is programmable.The voltage is 3V~3.6V.There is a memory device mounted in Surface Mount position for this device.A data storage size of 1Mb is allowed.In addition to this part, you can search "XC1701L" for other similar parts.FPGA reuqires a supply voltage of 3.3V.Various functions can be applied to 20 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.Minimum voltage 3V is required for the device to work.Using the CONFIGURATION MEMORY memory chip, we can store data.If you're reflow soldering, you shouldn't go above 245.A 20 pin is included in it.With the help of SERIAL-processing, data is sent through this memory.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.With the part are included 20 pins.When it comes to speed, this is a memory IC that can work at a frequency of 15MHz, which is very fast.In the memory, the I/O configuration has been set to COMMON.Memory is recommended that a 3.3V power supply be used.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC1701LPCG20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1701LPCG20C Applications
There are a lot of Xilinx Inc. XC1701LPCG20C applications of configuration proms for FPGAs.
cell phones
nonvolatile BIOS memory
eDRAM
eSRAM
main computer memory
DVD disk buffer
supercomputers
graphics card
embedded logic
workstations,
An interesting 20-LCC (J-Lead) package is used for this.The external packaging of Tray is made of Tray plastic.As a qualified employee, I can operate within 0°C~70°C.Through OTP, it is programmable.The voltage is 3V~3.6V.There is a memory device mounted in Surface Mount position for this device.A data storage size of 1Mb is allowed.In addition to this part, you can search "XC1701L" for other similar parts.FPGA reuqires a supply voltage of 3.3V.Various functions can be applied to 20 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.Minimum voltage 3V is required for the device to work.Using the CONFIGURATION MEMORY memory chip, we can store data.If you're reflow soldering, you shouldn't go above 245.A 20 pin is included in it.With the help of SERIAL-processing, data is sent through this memory.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.With the part are included 20 pins.When it comes to speed, this is a memory IC that can work at a frequency of 15MHz, which is very fast.In the memory, the I/O configuration has been set to COMMON.Memory is recommended that a 3.3V power supply be used.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC1701LPCG20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC1701LPCG20C Applications
There are a lot of Xilinx Inc. XC1701LPCG20C applications of configuration proms for FPGAs.
cell phones
nonvolatile BIOS memory
eDRAM
eSRAM
main computer memory
DVD disk buffer
supercomputers
graphics card
embedded logic
workstations,
XC1701LPCG20C More Descriptions
XC1701L Matte Tin (Sn) e3 Tray ics fpga configuration 8.9662mm 0.00005A 1Mb 3.3V
IC PROM SERIAL CONFIG 2M 44-PLCC
IC PROM SERIAL 1K 20-PLCC
IC PROM SERIAL CONFIG 2M 44-PLCC
IC PROM SERIAL 1K 20-PLCC
The three parts on the right have similar specifications to XC1701LPCG20C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusReach Compliance CodeJESD-30 CodeECCN CodeOperating Supply VoltageVoltageDensityRadiation HardeningLead FreeView Compare
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XC1701LPCG20CSurface Mount20-LCC (J-Lead)YES200°C~70°CTray2004e3yesObsolete3 (168 Hours)20Matte Tin (Sn)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS3V~3.6VQUADJ BEND24513.3V1.27mm30XC1701L20Not Qualified3.6V3.3V3VOTP1MbSYNCHRONOUS15MHz0.01mA1MX13-STATE10.00005A1048576 bitSERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mmRoHS Compliant---------
-
Surface Mount20-LCC (J-Lead)YES-0°C~70°CTube-e0noObsolete3 (168 Hours)20TIN LEADUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VQUADJ BEND22515V1.27mm30-20COMMERCIAL5.25V-4.75VOTP36kbSYNCHRONOUS--36288X1-1-36288 bitSERIAL-CONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS CompliantunknownS-PQCC-J20------
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.75V~5.25VDUAL-22515V2.54mm30XC17256E8--5V-OTP256Kb-15MHz0.01mA256KX13-STATE10.00005A-SERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliant--EAR995V5V256 kbNoContains Lead
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASCMOS4.5V~5.5VDUAL-22515V2.54mm30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS Compliantnot_compliant-EAR99----Contains Lead
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