Xilinx Inc. XA6SLX9-2FTG256Q
- Part Number:
- XA6SLX9-2FTG256Q
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3632816-XA6SLX9-2FTG256Q
- Description:
- IC FPGA 186 I/O 256FTGBGA
- ECAD Model:
-
- Datasheet:
- XA6SLX9-2FTG256Q
Xilinx Inc. XA6SLX9-2FTG256Q technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XA6SLX9-2FTG256Q.
- Factory Lead Time11 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature-40°C~125°C TJ
- PackagingTray
- Published2008
- SeriesAutomotive, AEC-Q100, Spartan®-6 LX XA
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- SubcategoryField Programmable Gate Arrays
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Terminal Pitch1mm
- Base Part NumberXA6SLX9
- Number of Outputs186
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Number of I/O186
- RAM Size72kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells9152
- Total RAM Bits589824
- Number of LABs/CLBs715
- Speed Grade2
- Number of Registers11440
- RoHS StatusROHS3 Compliant
XA6SLX9-2FTG256Q Overview
5 The package or case for this particular product is a 256-LBGA, which stands for Land Grid Array Ball Grid Array. It was published in 2008 and is classified under JESD-609 Code e1. The packaging method used for this product is a tray. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours without any damage. This package has a total of 256 terminations and they are all located at the bottom of the package. The terminals are in the form of balls, known as Ball Grid Array (BGA). This package also has a high number of logic elements or cells, totaling to 9152. The speed grade for this product is 2.5, making it a high-performance and efficient option for electronic devices.
XA6SLX9-2FTG256Q Features
186 I/Os
Up to 589824 RAM bits
256 LABs/CLBs
11440 registers
XA6SLX9-2FTG256Q Applications
There are a lot of Xilinx Inc. XA6SLX9-2FTG256Q FPGAs applications.
Automation
Secure Communication
Development Boards and Shields for Microcontrollers
Medical imaging
Voice recognition
Data Center
Medical ultrasounds
Data Mining
Cryptography
Embedded Vision
5 The package or case for this particular product is a 256-LBGA, which stands for Land Grid Array Ball Grid Array. It was published in 2008 and is classified under JESD-609 Code e1. The packaging method used for this product is a tray. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours without any damage. This package has a total of 256 terminations and they are all located at the bottom of the package. The terminals are in the form of balls, known as Ball Grid Array (BGA). This package also has a high number of logic elements or cells, totaling to 9152. The speed grade for this product is 2.5, making it a high-performance and efficient option for electronic devices.
XA6SLX9-2FTG256Q Features
186 I/Os
Up to 589824 RAM bits
256 LABs/CLBs
11440 registers
XA6SLX9-2FTG256Q Applications
There are a lot of Xilinx Inc. XA6SLX9-2FTG256Q FPGAs applications.
Automation
Secure Communication
Development Boards and Shields for Microcontrollers
Medical imaging
Voice recognition
Data Center
Medical ultrasounds
Data Mining
Cryptography
Embedded Vision
XA6SLX9-2FTG256Q More Descriptions
FPGA XA Spartan-6 Family 9152 Cells 45nm (CMOS) Technology 1.2V 256-Pin TFBGA
FPGA - Field Programmable Gate Array
IC FPGA 186 I/O 256FTGBGA
IC FPGA 160 I/O 225CSBGA
FPGA - Field Programmable Gate Array
IC FPGA 186 I/O 256FTGBGA
IC FPGA 160 I/O 225CSBGA
The three parts on the right have similar specifications to XA6SLX9-2FTG256Q.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishSubcategoryVoltage - SupplyTerminal PositionTerminal FormTerminal PitchBase Part NumberNumber of OutputsQualification StatusOperating Supply VoltageNumber of I/ORAM SizeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersRoHS StatusContact PlatingECCN CodePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Max Operating TemperatureMin Operating TemperatureClock FrequencyScreening LevelNumber of Logic Blocks (LABs)View Compare
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XA6SLX9-2FTG256Q11 WeeksSurface MountSurface Mount256-LBGA256-40°C~125°C TJTray2008Automotive, AEC-Q100, Spartan®-6 LX XAe1Active3 (168 Hours)256Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate Arrays1.14V~1.26VBOTTOMBALL1mmXA6SLX9186Not Qualified1.2V18672kBFIELD PROGRAMMABLE GATE ARRAY9152589824715211440ROHS3 Compliant---------- -
10 WeeksSurface MountSurface Mount484-FBGA, CSPBGA484-40°C~125°C TJTray2008Automotive, AEC-Q100, Spartan®-6 LX XAe1Active3 (168 Hours)-TIN SILVER COPPER-1.14V~1.26V------1.2V328387kBFIELD PROGRAMMABLE GATE ARRAY7463731703045831293296ROHS3 CompliantCopper, Silver, Tin3A991.D26030-----
-
-Surface Mount--324----e1-3 (168 Hours)324-Field Programmable Gate Arrays-BOTTOMBALL0.8mm-190Not Qualified1.2V190261kBFIELD PROGRAMMABLE GATE ARRAY43661--354576RoHS Compliant-EAR9926030100°C-40°C62.5MHzAEC-Q1003411
-
10 WeeksSurface MountSurface Mount256-LBGA256-40°C~125°C TJTray2008Automotive, AEC-Q100, Spartan®-6 LX XAe1Active3 (168 Hours)256Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate Arrays1.14V~1.26VBOTTOMBALL1mmXA6SLX16186Not Qualified1.2V18672kBFIELD PROGRAMMABLE GATE ARRAY145795898241139218224ROHS3 Compliant---------
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