XA3S250E-4FTG256I

Xilinx Inc. XA3S250E-4FTG256I

Part Number:
XA3S250E-4FTG256I
Manufacturer:
Xilinx Inc.
Ventron No:
3632924-XA3S250E-4FTG256I
Description:
IC FPGA 172 I/O 256FTBGA
ECAD Model:
Datasheet:
XA3S250E-4FTG256I

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Specifications
Xilinx Inc. XA3S250E-4FTG256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XA3S250E-4FTG256I.
  • Mount
    Surface Mount
  • Number of Pins
    256
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Pin Count
    256
  • Number of Outputs
    132
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.21.2/3.32.5V
  • Temperature Grade
    INDUSTRIAL
  • Number of I/O
    172
  • RAM Size
    27kB
  • Clock Frequency
    572MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    5508
  • Number of Gates
    250000
  • Screening Level
    AEC-Q100
  • Number of Logic Blocks (LABs)
    612
  • Speed Grade
    4
  • Number of CLBs
    612
  • Length
    17mm
  • Height Seated (Max)
    1.55mm
  • Width
    17mm
  • RoHS Status
    RoHS Compliant
Description
XA3S250E-4FTG256I Overview
FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 172 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 5508 logic elements/cells. An electrical supply voltage of 1.2V powers it. A Field Programmable Gate Arrays-series FPGA part. In order to make this device as versatile as possible, there are 132 different outputs included. As a whole, it has 256 terminations. The FPGA module's RAM si27kBe reaches 27kB in order to ensure that the program operates in a normal manner. 256 pins are designed into the device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.2V-volt supply allows designers to fully utilize its flexibility. Powered by a 1.21.2/3.32.5V power supply, it can be operated by almost anyone. As far as the maximum operating temperature of this module is concerned, it reaches 100°C. Operating temperatures should exceed -40°C. Among its basic building blocks, there are 250000 gates that are included in it. In addition to this, it has 256 pins. 612 logic blocks (LABs) make up its basic building blocks. Normally, fpga semiconductor uses an oscillator, which oscillates at 572MHz, to create the signal. In its architecture, there are 612 CLB modules.

XA3S250E-4FTG256I Features
172 I/Os
256 LABs/CLBs
100°C gates
612 logic blocks (LABs)


XA3S250E-4FTG256I Applications
There are a lot of Xilinx
XA3S250E-4FTG256I FPGAs applications.


Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
XA3S250E-4FTG256I More Descriptions
FPGA XA Spartan-3E Family 250K Gates 5508 Cells 572MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100
CoC and 2-years warranty / RFQ for pricing
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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