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Intersil X5328S8Z-2.7T1

Part Number:

X5328S8Z-2.7T1

Manufacturer:

Intersil

Ventron No:

3277712-X5328S8Z-2.7T1

Description:

IC CPU SUPERV 32K EE 8-SOIC

ECAD Model:

Datasheet:

X5328S8Z-2.7T1

Payment:

Payment

Delivery:

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Reference Price ( In US Dollars )

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Qty

Unit Price

Ext Price

  • 1

    $3.7586

    $3.76

  • 200

    $1.4546

    $290.92

  • 500

    $1.4035

    $701.75

  • 1000

    $1.3788

    $1378.80

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    One Stop Service

  • Competitive Price

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    Same Day Delivery

Part Overview

Description
The X5328 and X5329 combine three functions: power-on reset control, supply voltage supervision, and block lock protect serial EEPROM memory. This combination reduces system cost, board space requirements, and increases reliability.

Features
Low Vcc detection and reset assertion
32Kbits of EEPROM
2MHz SPI interface modes
Minimize EEPROM programming time
2.7V to 5.5V and 4.5V to 5.5V power supply operation

Applications
Power-on reset control
Supply voltage supervision
Serial EEPROM memory

Specifications

Intersil X5328S8Z-2.7T1 technical specifications, attributes, parameters and parts with similar specifications to Intersil X5328S8Z-2.7T1.

  • Factory Lead Time
    7 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SOIC (0.154, 3.90mm Width)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C TA
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    X5328
  • Output
    Open Drain or Open Collector
  • Pin Count
    8
  • Reset

    Reset is an electronic component parameter that refers to the process of returning a device or system to its initial state. This can be done by applying a specific voltage or signal to the device, or by physically resetting the device. Resetting a device can be used to clear errors, restore default settings, or to start the device over from the beginning.

    Active Low
  • Voltage - Threshold
    2.63V
  • Number of Voltages Monitored
    1
  • Reset Timeout
    100ms Minimum
  • RoHS Status
    ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to X5328S8Z-2.7T1.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Output
    Pin Count
    Reset
    Voltage - Threshold
    Number of Voltages Monitored
    Reset Timeout
    RoHS Status
    View Compare
  • X5328S8Z-2.7T1
    X5328S8Z-2.7T1
    7 Weeks
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    0°C~70°C TA
    Tape & Reel (TR)
    e3
    Active
    1 (Unlimited)
    EAR99
    Matte Tin (Sn) - annealed
    NOT SPECIFIED
    NOT SPECIFIED
    X5328
    Open Drain or Open Collector
    8
    Active Low
    2.63V
    1
    100ms Minimum
    ROHS3 Compliant
    -
  • X5323S8-2.7A
    -
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    0°C~70°C TA
    Tube
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    X5323
    Open Drain or Open Collector
    -
    Active Low
    2.92V
    1
    100ms Minimum
    Non-RoHS Compliant
  • X5325PI-2.7
    -
    Through Hole
    8-DIP (0.300, 7.62mm)
    -40°C~85°C TA
    Tube
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    X5325
    Open Drain or Open Collector
    -
    Active High
    2.63V
    1
    100ms Minimum
    Non-RoHS Compliant
  • X5323S8IT1
    -
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    X5323
    Open Drain or Open Collector
    -
    Active Low
    4.38V
    1
    100ms Minimum
    Non-RoHS Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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