Winbond Electronics W971GG8SB-25
- Part Number:
- W971GG8SB-25
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3232923-W971GG8SB-25
- Description:
- IC SDRAM 1GBIT 400MHZ 60BGA
- Datasheet:
- W971GG8SB-25
Winbond Electronics W971GG8SB-25 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W971GG8SB-25.
- Package / CaseTFBGA
- Surface MountYES
- Number of Terminations60
- ECCN CodeEAR99
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Additional FeatureAUTO/SELF REFRESH
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B60
- Supply Voltage-Max (Vsup)1.9V
- Temperature GradeOTHER
- Supply Voltage-Min (Vsup)1.7V
- InterfaceParallel
- Number of Ports1
- Memory TypeDDR2 SDRAM, RAM
- Operating ModeSYNCHRONOUS
- Organization128MX8
- Memory Width8
- Memory Density1073741824 bit
- Access Time (Max)0.4 ns
- Access ModeMULTI BANK PAGE BURST
- Length12.5mm
- Height Seated (Max)1.2mm
- Width8mm
- RoHS StatusRoHS Compliant
W971GG8SB-25 Overview
In this case, the memory type of the device can be classified as DDR2 SDRAM, RAM. An embedded TFBGA case surrounds memory ics. It is planted on the chip with 60 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. This chip is not only loaded with advantages, but it also comes with AUTO/SELF REFRESH, which boosts the performance of your system. Several ports on this chip are used to access one memory address for reading and writing. In order for this device to function properly, its operating temperature must not be less than 0°C. The temperature should not exceed 85°C degrees Celsius.
W971GG8SB-25 Features
Package / Case: TFBGA
Additional Feature:AUTO/SELF REFRESH
W971GG8SB-25 Applications
There are a lot of Winbond Electronics Corporation
W971GG8SB-25 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
In this case, the memory type of the device can be classified as DDR2 SDRAM, RAM. An embedded TFBGA case surrounds memory ics. It is planted on the chip with 60 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. This chip is not only loaded with advantages, but it also comes with AUTO/SELF REFRESH, which boosts the performance of your system. Several ports on this chip are used to access one memory address for reading and writing. In order for this device to function properly, its operating temperature must not be less than 0°C. The temperature should not exceed 85°C degrees Celsius.
W971GG8SB-25 Features
Package / Case: TFBGA
Additional Feature:AUTO/SELF REFRESH
W971GG8SB-25 Applications
There are a lot of Winbond Electronics Corporation
W971GG8SB-25 Memory applications.
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
W971GG8SB-25 More Descriptions
DDR2 128Mx8 bit 800MHz, 6-6-6, 1.8V, WBGA 60Ball 8*12.5mm
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
IC SDRAM 1GBIT 400MHZ 60BGA
IC DRAM 1G PARALLEL 60WBGA
OEMs, CMs ONLY (NO BROKERS)
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
IC SDRAM 1GBIT 400MHZ 60BGA
IC DRAM 1G PARALLEL 60WBGA
OEMs, CMs ONLY (NO BROKERS)
The three parts on the right have similar specifications to W971GG8SB-25.
-
ImagePart NumberManufacturerPackage / CaseSurface MountNumber of TerminationsECCN CodeMax Operating TemperatureMin Operating TemperatureAdditional FeatureTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)InterfaceNumber of PortsMemory TypeOperating ModeOrganizationMemory WidthMemory DensityAccess Time (Max)Access ModeLengthHeight Seated (Max)WidthRoHS StatusFactory Lead TimeMounting TypeNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Voltage - SupplyReflow Temperature-Max (s)Operating Supply VoltageMemory SizeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageAddress Bus WidthDensitySupplier Device PackageMountQualification StatusNominal Supply CurrentOutput CharacteristicsStandby Current-MaxI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthView Compare
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W971GG8SB-25TFBGAYES60EAR9985°C0°CAUTO/SELF REFRESHCMOSBOTTOMBALLNOT SPECIFIED11.8V0.8mmNOT SPECIFIEDR-PBGA-B601.9VOTHER1.7VParallel1DDR2 SDRAM, RAMSYNCHRONOUS128MX881073741824 bit0.4 nsMULTI BANK PAGE BURST12.5mm1.2mm8mmRoHS Compliant------------------------------
-
84-TFBGAYES84---AUTO/SELF REFRESHSDRAM - DDR2BOTTOM-NOT SPECIFIED11.8V0.8mm--1.9V-1.7V-1VolatileSYNCHRONOUS64MX1616---12.5mm1.2mm-ROHS3 Compliant10 WeeksSurface Mount84-40°C~95°C TCTray2011Active3 (168 Hours)1.7V~1.9VNOT SPECIFIED1.8V1Gb 64M x 16200MHz400psDRAMParallel15ns13b1 Gb----------
-
84-TFBGA------SDRAM - DDR2-------------Volatile---------ROHS3 Compliant10 WeeksSurface Mount--40°C~95°C TCTape & Reel (TR)2016Active3 (168 Hours)1.7V~1.9V--1Gb 64M x 16200MHz400psDRAMParallel15ns--84-WBGA (8x12.5)---------
-
84-TFBGA-84---AUTO/SELF REFRESHSDRAM - DDR2BOTTOM--11.8V0.8mm--1.9V-1.7V-1VolatileSYNCHRONOUS64MX1616---12.5mm1.2mm-ROHS3 Compliant-Surface Mount840°C~85°C TCTray2011Obsolete3 (168 Hours)1.7V~1.9V-1.8V1Gb 64M x 16200MHz400psDRAMParallel15ns16b1 Gb-Surface MountNot Qualified120mA3-STATE0.008ACOMMON81924848
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