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W29N01HVDINF

Winbond Electronics W29N01HVDINF

Part Number:
W29N01HVDINF
Manufacturer:
Winbond Electronics
Ventron No:
3231911-W29N01HVDINF
Description:
IC FLASH 1GBIT 25NS 48VFBGA
ECAD Model:
Datasheet:
Migration from W29N01GV to W29N01HV

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Specifications
Winbond Electronics W29N01HVDINF technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29N01HVDINF.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    48-VFBGA
  • Surface Mount
    YES
  • Number of Pins
    48
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2016
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Technology
    FLASH - NAND (SLC)
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.8mm
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    1Gb 128M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    128MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    25ns
  • Memory Density
    1073741824 bit
  • Programming Voltage
    3.3V
  • Height Seated (Max)
    1mm
  • Length
    8mm
  • Width
    6.5mm
  • RoHS Status
    ROHS3 Compliant
Description
W29N01HVDINF Overview
The Surface Mount technology has become increasingly popular due to its compact size and efficient use of space on a circuit board. In 2016, a new product was published using this technology, with a memory size of 1Gb 128M x 8, making it suitable for a variety of applications. With an operating temperature range of -40°C to 85°C, this product is designed to withstand extreme environments. Additionally, it is RoHS3 compliant, ensuring it is environmentally friendly. The Pbfree code of "yes" also indicates that this product is free of hazardous substances. Its terminal position at the bottom and a terminal pitch of 0.8mm make it easy to integrate into any circuit design. Furthermore, with a width of only 6.5mm, it is a space-saving solution for electronic devices.

W29N01HVDINF Features
Package / Case: 48-VFBGA
48 Pins


W29N01HVDINF Applications
There are a lot of Winbond Electronics
W29N01HVDINF Memory applications.


mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
W29N01HVDINF More Descriptions
SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 48-Pin VFBGA
1Gb SLC NAND Flash 40MHz VFBGA48
VFBGA-48(8x6.5) NAND FLASH ROHS
IC FLASH 1GBIT PARALLEL 48VFBGA
Product Comparison
The three parts on the right have similar specifications to W29N01HVDINF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Programming Voltage
    Height Seated (Max)
    Length
    Width
    RoHS Status
    JESD-30 Code
    Mount
    Operating Supply Voltage
    Address Bus Width
    Density
    Page Size
    View Compare
  • W29N01HVDINF
    W29N01HVDINF
    Winbond Electronics
    10 Weeks
    Surface Mount
    48-VFBGA
    YES
    48
    -40°C~85°C TA
    Tray
    2016
    yes
    Active
    3 (168 Hours)
    48
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3V
    0.8mm
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    128MX8
    8
    25ns
    1073741824 bit
    3.3V
    1mm
    8mm
    6.5mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • W29N04GVSIAF
    W29N04GVSIAF
    Winbond Electronics
    10 Weeks
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    YES
    -
    -40°C~85°C TA
    Tray
    2016
    -
    Active
    3 (168 Hours)
    48
    FLASH - NAND (SLC)
    2.7V~3.6V
    DUAL
    1
    3V
    0.5mm
    3.6V
    2.7V
    4Gb 512M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    512MX8
    8
    25ns
    4294967296 bit
    3.3V
    1.2mm
    18.4mm
    12mm
    ROHS3 Compliant
    R-PDSO-G48
    -
    -
    -
    -
    -
    W29N01HVDINF vs W29N04GVSIAF
  • W29N04GVBIAA
    W29N04GVBIAA
    Winbond Electronics
    10 Weeks
    Surface Mount
    63-VFBGA
    YES
    63
    -40°C~85°C TA
    Tray
    2016
    yes
    Active
    3 (168 Hours)
    63
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3.3V
    0.8mm
    3.6V
    2.7V
    4Gb 512M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    512MX8
    8
    25ns
    4294967296 bit
    3.3V
    1mm
    11mm
    9mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    W29N01HVDINF vs W29N04GVBIAA
  • W29N01HVSINF
    W29N01HVSINF
    Winbond Electronics
    10 Weeks
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    -
    48
    -40°C~85°C TA
    Tray
    2016
    yes
    Active
    3 (168 Hours)
    48
    FLASH - NAND (SLC)
    2.7V~3.6V
    DUAL
    1
    3V
    0.5mm
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    128MX8
    8
    25ns
    -
    -
    1.2mm
    18.4mm
    -
    ROHS3 Compliant
    -
    Surface Mount
    3.3V
    28b
    1 Gb
    2.1kB
    W29N01HVDINF vs W29N01HVSINF
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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