Winbond Electronics W29GL512PL9T
- Part Number:
- W29GL512PL9T
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3233414-W29GL512PL9T
- Description:
- IC FLASH 512MBIT 90NS 56TSOP
- Datasheet:
- W29GL512PL9T
Winbond Electronics W29GL512PL9T technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29GL512PL9T.
- Mounting TypeSurface Mount
- Package / Case56-TFSOP (0.724, 18.40mm Width)
- Supplier Device Package56-TSOP
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2016
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- InterfaceParallel
- Memory Size512Mb 64M x 8 32M x 16
- Memory TypeNon-Volatile
- Access Time90ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Write Cycle Time - Word, Page90ns
- RoHS StatusROHS3 Compliant
W29GL512PL9T Overview
The Surface Mount Mounting Type is a popular choice for electronic components, including the 56-TSOP Supplier Device Package. This type of packaging is designed to be placed directly onto the surface of a printed circuit board, making it easier and more efficient to assemble. In 2016, this particular device package was published, showcasing its reliability and functionality. However, it is important to note that it is currently listed as Not For New Designs, indicating that there may be newer and more advanced options available. With a maximum operating temperature of 85°C and a voltage supply range of 2.7V~3.6V, this device is suitable for a variety of applications. Its access time of 90ns and parallel memory interface make it a speedy and efficient choice, with a write cycle time of 90ns for both word and page operations.
W29GL512PL9T Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
W29GL512PL9T Applications
There are a lot of Winbond Electronics
W29GL512PL9T Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
The Surface Mount Mounting Type is a popular choice for electronic components, including the 56-TSOP Supplier Device Package. This type of packaging is designed to be placed directly onto the surface of a printed circuit board, making it easier and more efficient to assemble. In 2016, this particular device package was published, showcasing its reliability and functionality. However, it is important to note that it is currently listed as Not For New Designs, indicating that there may be newer and more advanced options available. With a maximum operating temperature of 85°C and a voltage supply range of 2.7V~3.6V, this device is suitable for a variety of applications. Its access time of 90ns and parallel memory interface make it a speedy and efficient choice, with a write cycle time of 90ns for both word and page operations.
W29GL512PL9T Features
Package / Case: 56-TFSOP (0.724, 18.40mm Width)
W29GL512PL9T Applications
There are a lot of Winbond Electronics
W29GL512PL9T Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
W29GL512PL9T More Descriptions
IC FLASH 512MBIT PARALLEL 56TSOP
The three parts on the right have similar specifications to W29GL512PL9T.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of TerminationsECCN CodeAdditional FeatureHTS CodeTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Operating ModeSupply Current-MaxOrganizationMemory WidthStandby Current-MaxMemory DensityAccess Time (Max)Programming VoltageAlternate Memory WidthData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyBoot BlockCommon Flash InterfaceLengthHeight Seated (Max)WidthNumber of PinsFactory Lead TimeMountNominal Supply CurrentAddress Bus WidthDensitySync/AsyncView Compare
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W29GL512PL9TSurface Mount56-TFSOP (0.724, 18.40mm Width)56-TSOP-40°C~85°C TATray2016Not For New Designs3 (168 Hours)85°C-40°CFLASH - NOR2.7V~3.6VParallel512Mb 64M x 8 32M x 16Non-Volatile90nsFLASHParallel90nsROHS3 Compliant--------------------------------------------
-
Surface Mount48-TFBGA--40°C~85°C TATube-Obsolete3 (168 Hours)--FLASH - NOR2.7V~3.6V-64Mb 8M x 8 4M x 16Non-Volatile-FLASHParallel70nsROHS3 CompliantYES483A991.B.1.ABOTTOM BOOT BLOCK8542.32.00.51BOTTOM13V0.8mm48R-PBGA-B48Not Qualified3.6V3/3.3V2.7VASYNCHRONOUS0.055mA64MX110.000005A67108864 bit70 ns3V8YESYESYES81278K64K8/16wordsYESBOTTOMYES8mm1.2mm6mm-------
-
Surface Mount64-LBGA64-LFBGA (11x13)-40°C~85°C TATray2016Not For New Designs3 (168 Hours)85°C-40°CFLASH - NOR2.7V~3.6VParallel512Mb 64M x 8 32M x 16Non-Volatile90nsFLASHParallel90nsROHS3 Compliant------------------------------------64------
-
Surface Mount64-LBGA--40°C~85°C TATube2016Obsolete3 (168 Hours)--FLASH - NOR2.7V~3.6V-64Mb 8M x 8 4M x 16Non-Volatile-FLASHParallel70nsROHS3 Compliant-643A991.B.1.ATOP BOOT BLOCK8542.32.00.51BOTTOM13V1mm64-Not Qualified3.6V3/3.3V2.7V---10.000005A-70 ns3V8YESYESYES8127-8/16wordsYESTOPYES13mm1.4mm-6414 WeeksSurface Mount55mA22b64 MbAsynchronous
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