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W25Q256FVFIG

Winbond Electronics W25Q256FVFIG

Part Number:
W25Q256FVFIG
Manufacturer:
Winbond Electronics
Ventron No:
3244917-W25Q256FVFIG
Description:
IC FLASH 256MBIT 80MHZ 16SOIC
ECAD Model:
Datasheet:
W25Q256FVFIG

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Specifications
Winbond Electronics W25Q256FVFIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q256FVFIG.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.295, 7.50mm Width)
  • Number of Pins
    16
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2016
  • Series
    SpiFlash®
  • Part Status
    Discontinued
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    16
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1.27mm
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    256Mb 32M x 8
  • Nominal Supply Current
    20mA
  • Memory Type
    Non-Volatile
  • Clock Frequency
    104MHz
  • Access Time
    8.5 ns
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O, QPI
  • Organization
    256MX1
  • Memory Width
    1
  • Write Cycle Time - Word, Page
    50μs, 3ms
  • Address Bus Width
    1b
  • Density
    256 Mb
  • Standby Current-Max
    0.000025A
  • Sync/Async
    Synchronous
  • Word Size
    8b
  • Programming Voltage
    3V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Height Seated (Max)
    2.64mm
  • Length
    10.31mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
W25Q256FVFIG Overview
The package or case for this device is a 16-SOIC with a width of 0.295 inches and a width of 7.50mm. It is designed to operate within a temperature range of -40°C to 85°C, making it suitable for a variety of environments. The packaging for this device comes in the form of a tube, providing protection during transportation and storage. With a total of 16 terminations, this device offers a sufficient number of connections for its intended use. The supply voltage for this device is 3V, providing the necessary power for its operation. The memory width is 1, and the address bus width is 1b, indicating its capabilities for storing and retrieving data. With a density of 256 Mb, this device offers a considerable amount of storage space. The standby current-max for this device is 0.000025A, ensuring minimal power consumption when not in use. Finally, the maximum seated height for this device is 2.64mm, making it compact and suitable for use in various electronic applications.

W25Q256FVFIG Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)
16 Pins
Operating Supply Voltage:3.3V


W25Q256FVFIG Applications
There are a lot of Winbond Electronics
W25Q256FVFIG Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
W25Q256FVFIG More Descriptions
NOR Flash Serial-SPI 3.3V 256M-bit 32M x 8 8.5ns 16-Pin SOIC
Surface Mount Tube 256MX1 FLASH - NOR ic memory 104MHz 8.5ns 10.31mm 20mA
SPI FLASH 256M bit SOIC 16PIN 300 MIL 58nm Taping & Reel
IC FLASH 256MBIT SPI/QUAD 16SOIC
Product Description Demo for Development.
TRANS NPN 750V 12A ISOWATT218FX
Product Comparison
The three parts on the right have similar specifications to W25Q256FVFIG.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Sync/Async
    Word Size
    Programming Voltage
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Lead Free
    ECCN Code
    Pin Count
    Power Supplies
    Factory Lead Time
    View Compare
  • W25Q256FVFIG
    W25Q256FVFIG
    Winbond Electronics
    Surface Mount
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    16
    -40°C~85°C TA
    Tube
    2016
    SpiFlash®
    Discontinued
    3 (168 Hours)
    16
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    3.3V
    3.6V
    2.7V
    SPI, Serial
    256Mb 32M x 8
    20mA
    Non-Volatile
    104MHz
    8.5 ns
    FLASH
    SPI - Quad I/O, QPI
    256MX1
    1
    50μs, 3ms
    1b
    256 Mb
    0.000025A
    Synchronous
    8b
    3V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    2.64mm
    10.31mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
  • W25Q128FVEIG
    W25Q128FVEIG
    Winbond Electronics
    Surface Mount
    Surface Mount
    8-WDFN Exposed Pad
    8
    -40°C~85°C TA
    Tube
    2016
    SpiFlash®
    Discontinued
    3 (168 Hours)
    8
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    -
    3.6V
    2.7V
    SPI, Serial
    128Mb 16M x 8
    20mA
    Non-Volatile
    104MHz
    7 ns
    FLASH
    SPI - Quad I/O, QPI
    -
    1
    50μs, 3ms
    24b
    128 Mb
    0.00002A
    Synchronous
    8b
    3V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    -
    -
    No
    ROHS3 Compliant
    -
    3A991.B.1.A
    8
    3/3.3V
    -
    W25Q256FVFIG vs W25Q128FVEIG
  • W25Q128JVBIQ TR
    W25Q128JVBIQ TR
    Winbond Electronics
    -
    Surface Mount
    24-TBGA
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2016
    SpiFlash®
    Active
    3 (168 Hours)
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    128Mb 16M x 8
    -
    Non-Volatile
    133MHz
    -
    FLASH
    SPI - Quad I/O, QPI, DTR
    -
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    10 Weeks
    W25Q256FVFIG vs W25Q128JVBIQ TR
  • W25Q128JVPIM TR
    W25Q128JVPIM TR
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    SpiFlash®
    Active
    3 (168 Hours)
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    128Mb 16M x 8
    -
    Non-Volatile
    133MHz
    -
    FLASH
    SPI - Quad I/O, QPI, DTR
    -
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    10 Weeks
    W25Q256FVFIG vs W25Q128JVPIM TR
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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