Winbond Electronics W25Q256FVCIP
- Part Number:
- W25Q256FVCIP
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3245981-W25Q256FVCIP
- Description:
- IC FLASH 256MBIT 24TFBGA
- ECAD Model:
-
- Datasheet:
- W25Q256FV
Winbond Electronics W25Q256FVCIP technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q256FVCIP.
- Mounting TypeSurface Mount
- Package / Case24-TBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTube
- SeriesSpiFlash®
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations24
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- JESD-30 CodeR-PBGA-B24
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size256Mb 32M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency104MHz
- Supply Current-Max0.025mA
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O, QPI
- Organization256MX1
- Memory Width1
- Write Cycle Time - Word, Page50μs, 3ms
- Standby Current-Max0.00002A
- Memory Density268435456 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Serial Bus TypeSPI
- Endurance100000 Write/Erase Cycles
- Data Retention Time-Min20
- Write ProtectionHARDWARE/SOFTWARE
- Height Seated (Max)1.2mm
- Length8mm
- Width6mm
- RoHS StatusROHS3 Compliant
W25Q256FVCIP Overview
The Surface Mount YES Packaging for this particular component is in a Tube form, making it easy to handle and store. However, it is important to note that the Part Status is Discontinued, meaning it may not be readily available in the market. With 24 Number of Terminations, this component can be used in a variety of applications. Its Operating Mode is SYNCHRONOUS, allowing for precise synchronization with other devices. With a Clock Frequency of 104MHz, it can handle high-speed operations. The Memory Format is FLASH, providing fast and reliable data storage. In addition, it has a low Standby Current-Max of 0.00002A, making it energy-efficient. With an Endurance of 100000 Write/Erase Cycles, it is a durable component. Its Height Seated (Max) is only 1.2mm, making it a compact and space-saving option.
W25Q256FVCIP Features
Package / Case: 24-TBGA
W25Q256FVCIP Applications
There are a lot of Winbond Electronics
W25Q256FVCIP Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The Surface Mount YES Packaging for this particular component is in a Tube form, making it easy to handle and store. However, it is important to note that the Part Status is Discontinued, meaning it may not be readily available in the market. With 24 Number of Terminations, this component can be used in a variety of applications. Its Operating Mode is SYNCHRONOUS, allowing for precise synchronization with other devices. With a Clock Frequency of 104MHz, it can handle high-speed operations. The Memory Format is FLASH, providing fast and reliable data storage. In addition, it has a low Standby Current-Max of 0.00002A, making it energy-efficient. With an Endurance of 100000 Write/Erase Cycles, it is a durable component. Its Height Seated (Max) is only 1.2mm, making it a compact and space-saving option.
W25Q256FVCIP Features
Package / Case: 24-TBGA
W25Q256FVCIP Applications
There are a lot of Winbond Electronics
W25Q256FVCIP Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
W25Q256FVCIP More Descriptions
SPI 256M 24Ball TFBGA8*6mm(6*4array) Power Down & OTPenabled
IC FLSH 256MBIT SPI/QUAD 24TFBGA
IC FLSH 256MBIT SPI/QUAD 24TFBGA
The three parts on the right have similar specifications to W25Q256FVCIP.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencySupply Current-MaxMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityParallel/SerialProgramming VoltageSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsPublishedECCN CodePin CountInterfaceNominal Supply CurrentAccess TimeAddress Bus WidthDensitySync/AsyncWord SizeRadiation HardeningFactory Lead TimeView Compare
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W25Q256FVCIPSurface Mount24-TBGAYES-40°C~85°C TATubeSpiFlash®Discontinued3 (168 Hours)24FLASH - NOR2.7V~3.6VBOTTOM13V1mmR-PBGA-B24Not Qualified3.6V3/3.3V2.7V256Mb 32M x 8Non-VolatileSYNCHRONOUS104MHz0.025mAFLASHSPI - Quad I/O, QPI256MX1150μs, 3ms0.00002A268435456 bitSERIAL3VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE1.2mm8mm6mmROHS3 Compliant--------------- -
Surface Mount8-WDFN Exposed Pad--40°C~85°C TATubeSpiFlash®Discontinued3 (168 Hours)8FLASH - NOR2.7V~3.6VDUAL13V1.27mm--3.6V3/3.3V2.7V128Mb 16M x 8Non-Volatile-104MHz-FLASHSPI - Quad I/O, QPI-150μs, 3ms0.00002A--3VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE---ROHS3 CompliantSurface Mount820163A991.B.1.A8SPI, Serial20mA7 ns24b128 MbSynchronous8bNo-
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Surface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms-----------ROHS3 Compliant--2016----------10 Weeks
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Surface Mount8-WDFN Exposed Pad--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms-----------ROHS3 Compliant-------------10 Weeks
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3/3.3V V Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 128 Mb kb 20mA mA 8b b
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