IDT, Integrated Device Technology Inc VF2510BGLFT

VF2510BGLFT Overview
The TSSOP package, with a total of 24 pins, is a popular choice for integrated circuits due to its compact size and high pin density. It is commonly used in electronics such as microcontrollers, memory chips, and power management devices. The package is available in Tape & Reel (TR) packaging, making it suitable for automated assembly processes. With 24 terminations, this package offers a high level of functionality, making it versatile for various applications. The terminal finish is MATTE TIN, providing a reliable and durable surface for soldering. The package dimensions are 7.8mm in length, 4.4mm in width, and 1mm in thickness, making it a space-saving option for compact designs. Additionally, with a minimum supply voltage of 2.97V, this package is efficient and reliable for low-power devices.

VF2510BGLFT Features
Peak Reflow Temperature (Cel): 260
Include 1 Circuits
with 24 Pins
operate supply voltage at the range of 3.3V

VF2510BGLFT Applications
There are a lot of Integrated Device Technology (IDT) VF2510BGLFT application specific timer?applications.

OTN Muxponders and Transponders
Test and Measurement
Servers
Broadcast video/audio timing
Printers, scanners, projectors
Industrial, Embedded Computing
Audio/video
GbE/10 GbE/100 GbE Synchronous Ethernet (ITU-T G.8262)
DU (Distribution Unit)
XO replacement