V23061B1010A501

TE Connectivity Potter & Brumfield Relays V23061B1010A501

Part Number:
V23061B1010A501
Manufacturer:
TE Connectivity Potter & Brumfield Relays
Ventron No:
3428304-V23061B1010A501
Description:
RELAY GEN PURPOSE SPDT 8A 60V
ECAD Model:
Datasheet:
V23061B1010A501

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
TE Connectivity Potter & Brumfield Relays V23061B1010A501 technical specifications, attributes, parameters and parts with similar specifications to TE Connectivity Potter & Brumfield Relays V23061B1010A501.
  • Contact Material
    Silver Nickel (AgNi)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C~85°C
  • Packaging
    Tube
  • Published
    2011
  • Series
    MSR, SCHRACK
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Termination Style
    PC Pin
  • Contact Form
    SPDT (1 Form C)
  • Relay Type
    General Purpose
  • Coil Resistance
    15.27kOhm
  • Operate Time
    10ms
  • Coil Voltage
    60VDC
  • Coil Type
    Non Latching
  • Switching Voltage
    400VAC -Max
  • Coil Current
    4mA
  • Release Time
    5ms
  • Must Operate Voltage
    40.8VDC
  • Contact Rating (Current)
    8A
  • Must Release Voltage
    6VDC
  • Seal Rating
    Sealed - Fully
  • Coil Insulation
    Class A
  • RoHS Status
    RoHS Compliant
Description
Images are for reference only.See Product Specifications for product details.If you are interested to buy Potter & Brumfield Relays / TE Connectivity V23061B1010A501.
V23061B1010A501 More Descriptions
POWER/SIGNAL RELAY, 1 FORM C, SP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 25 September 2023

    A Comparison of 2N7000 and BS170 N-Channel Mosfet Transistors

    Ⅰ. What is a MOS field effect transistor?Ⅱ. Overview of 2N7000Ⅲ. Overview of BS170Ⅳ. 2N7000 vs BS170: PCB footprintsⅤ. 2N7000 vs BS170: Technical parametersⅥ. 2N7000 vs BS170: FeaturesⅦ....
  • 26 September 2023

    W25Q128JVSIQ Footprint, Features and Package

    Ⅰ. W25Q128JVSIQ descriptionⅡ. W25Q128JVSIQ symbol and footprintⅢ. Technical parametersⅣ. Features of W25Q128JVSIQⅤ. Pin configuration of W25Q128JVSIQⅥ. Package of W25Q128JVSIQⅦ. What are the characteristics of the SPI interface of...
  • 26 September 2023

    TDA7560 Audio Power Amplifier: Symbol, Features and Application

    Ⅰ. Overview of TDA7560Ⅱ. Pin connection, symbol and footprint of TDA7560Ⅲ. Technical parametersⅣ. Features of TDA7560Ⅴ. Application of TDA7560Ⅵ. Are TDA7560 and TDA7851 interchangeable?Ⅶ. TDA7560 car power amplifier...
  • 27 September 2023

    BC640 PNP Transistor: Features, Package and Other Details

    Ⅰ. Overview of BC640Ⅱ. Symbol and footprint of BC640Ⅲ. Technical parametersⅣ. Features of BC640Ⅴ. Pinout and package of BC640Ⅵ. Application of BC640Ⅶ. How to optimize the performance of...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.