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Home > Products > Integrated Circuits (ICs) > PMIC - Laser Drivers > TZA3011BVH/C2,557
TZA3011BVH/C2,557
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NXP USA Inc. TZA3011BVH/C2,557

Part Number:

TZA3011BVH/C2,557

Manufacturer:

NXP USA Inc.

Ventron No:

3257156-TZA3011BVH/C2,557

Description:

IC LASER DRIVER 3.2GBPS 32-HBCC

ECAD Model:

Datasheet:

TZA3011A,B

Payment:

Payment

Delivery:

Delivery

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Part Overview

Description
The TZA3011 is a fully integrated laser driver for optical transmission systems with data rates up to 3.2 Gbit/s. It incorporates all necessary control and protection functions for laser driver applications, requiring few external components and low power dissipation. The dual-loop controls the average monitor current in a programmable range from 150 μA to 1300 μA and the extinction ratio in a programmable range from 5 to 15 (linear scale).

Features
A-rate TM from 30 Mbit/s to 3.2 Gbit/s
Bias current up to 100 mA
Modulation current up to 100 mA
Rise and fall times typical 80 ps
Jitter below 20 ps (peak-to-peak value)
Modulation output voltage up to 2 V dynamic range
1.2 V minimum voltage on the modulation output pin and 0.4 V minimum voltage on pin BIAS
Retiming function via external clock with disable option
Pulse width adjustment function with disable option
Positive Emitter Coupled Logic (PECL), Low Voltage Positive Emitter Coupled Logic (LVPECL), and Current-Mode Logic (CML) compatible data and clock inputs
Internal common mode voltage available for AC-coupled data and clock inputs and for single-ended applications
3.3 V supply voltage
TZA3011A: AC-coupled laser for 3.3 V laser supply
TZA3011B: DC-coupled laser for 3.3 V and 5 V laser supply

Applications
Optical transmission systems
Datacom and telecom applications
High-speed data links
Fiber optic communications

Specifications

NXP USA Inc. TZA3011BVH/C2,557 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. TZA3011BVH/C2,557.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-WFQFN Exposed Pad
  • Supplier Device Package
    32-HBCC (5x5)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tray
  • Published
    2001
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    A-rate™
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    3.14V~3.47V
  • Base Part Number
    TZA3011
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    1
  • Current - Supply
    40mA
  • Data Rate

    Data rate, measured in bits per second (bps), is the rate at which data is transferred from one device to another. It is a measure of the speed of data transmission and is influenced by factors such as the bandwidth of the communication channel and the efficiency of the data encoding scheme. A higher data rate indicates faster data transfer, allowing for the transmission of more data in a given amount of time.

    3.2Gbps
  • Current - Modulation
    100mA
  • Current - Bias
    100mA
  • RoHS Status
    ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to TZA3011BVH/C2,557.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Base Part Number
    Number of Channels
    Current - Supply
    Data Rate
    Current - Modulation
    Current - Bias
    RoHS Status
    View Compare
  • TZA3011BVH/C2,557
    TZA3011BVH/C2,557
    NXP USA Inc.
    Surface Mount
    32-WFQFN Exposed Pad
    32-HBCC (5x5)
    -40°C~85°C
    Tray
    2001
    A-rate™
    Obsolete
    1 (Unlimited)
    3.14V~3.47V
    TZA3011
    1
    40mA
    3.2Gbps
    100mA
    100mA
    ROHS3 Compliant
    -
  • TZA3047BVH/C1,557
    TZA3047BVH/C1,557
    NXP USA Inc.
    Surface Mount
    32-WFQFN Exposed Pad
    32-HBCC (5x5)
    -40°C~85°C
    Tray
    2002
    -
    Obsolete
    1 (Unlimited)
    3.14V~3.47V
    TZA3047
    1
    40mA
    1.25Gbps
    100mA
    100mA
    ROHS3 Compliant
    TZA3011BVH/C2,557 vs TZA3047BVH/C1,557
  • TZA3011AVH/C2,557
    TZA3011AVH/C2,557
    NXP USA Inc.
    Surface Mount
    32-WFQFN Exposed Pad
    32-HBCC (5x5)
    -40°C~85°C
    Tray
    2001
    A-rate™
    Obsolete
    1 (Unlimited)
    3.14V~3.47V
    TZA3011
    1
    40mA
    3.2Gbps
    100mA
    100mA
    ROHS3 Compliant
    TZA3011BVH/C2,557 vs TZA3011AVH/C2,557
  • TZA3011AVH/C2,551
    TZA3011AVH/C2,551
    NXP USA Inc.
    Surface Mount
    32-WFQFN Exposed Pad
    32-HBCC (5x5)
    -40°C~85°C
    Tray
    2001
    A-rate™
    Obsolete
    1 (Unlimited)
    3.14V~3.47V
    TZA3011
    1
    40mA
    3.2Gbps
    100mA
    100mA
    ROHS3 Compliant
    TZA3011BVH/C2,557 vs TZA3011AVH/C2,551

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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