TMS320DM368ZCEF

BGA TMS320DM368ZCEF

Part Number:
TMS320DM368ZCEF
Manufacturer:
BGA
Ventron No:
6024347-TMS320DM368ZCEF
Description:
ECAD Model:
Datasheet:
tms320dm368

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Specifications
BGA TMS320DM368ZCEF technical specifications, attributes, parameters and parts with similar specifications to BGA TMS320DM368ZCEF.
  • Voltage - I/O:
    1.8V, 3.3V
  • Voltage - Core:
    1.35V
  • Type:
    Digital Media System-on-Chip (DMSoC)
  • Supplier Device Package:
    338-NFBGA (13x13)
  • Series:
    TMS320DM3x, DaVinci™
  • Packaging:
    Tray
  • Package / Case:
    338-LFBGA
  • Other Names:
    296-41885
    TMS320DM368ZCEF-ND
  • Operating Temperature:
    0°C ~ 85°C (TC)
  • On-Chip RAM:
    56kB
  • Non-Volatile Memory:
    ROM (16 kB)
  • Mounting Type:
    Surface Mount
  • Moisture Sensitivity Level (MSL):
    3 (168 Hours)
  • Manufacturer Standard Lead Time:
    12 Weeks
  • Lead Free Status / RoHS Status:
    Lead free / RoHS Compliant
  • Interface:
    EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB
  • Clock Rate:
    432MHz
  • Base Part Number:
    TMS320DM368
Description
The TMS320DM368ZCEF is , it is part of TMS320DM3x, DaVinci™ series. they are designed to work as Housingless Welding Diode.TMS320DM368ZCEF with pin details manufactured by . The TMS320DM368ZCEF is available in 338-NFBGA (13x13) Package,it is part of the electronic component Chips.that includes TMS320DM3x, DaVinci™ Series. they are designed to operate as Housingless Welding Diode.it is with Operating Temperature 0°C ~ 85°C (TC).TMS320DM368ZCEF with original stock manufactured by . The TMS320DM368ZCEF is available in 338-NFBGA (13x13) Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of TMS320DM368ZCEFis designed to work in 338-LFBGA, it's Operating Temperature is 0°C ~ 85°C (TC).The TMS320DM368ZCEF is available in 338-LFBGA Package, is part of the Housingless Welding Diode and belong to RF Semiconductors.TMS320DM368ZCEF with EDA / CAD Models manufactured by . The TMS320DM368ZCEF is available in 338-NFBGA (13x13)Package, is part of the RF Semiconductors.The TMS320DM368ZCEF is Housingless Welding Diode with package 338-LFBGA manufactured by . The TMS320DM368ZCEF is available in 338-NFBGA (13x13) Package, is part of the .
TMS320DM368ZCEF More Descriptions
DSP 16bit/32bit 432MHz 338-Pin NFBGA Tray / IC DGTL MEDIA SOC 338NFBGA
DaVinci Digital Media Processor 338-NFBGA 0 to 85
EBI/EMI Ethernet I2C McBSP SPI UART USB 338-LFBGA ACTIVE (Last Updated: 6days ago) 320DM368 digital signal processor 1.42V 1.3mm 432MHz 32kB
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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