Texas Instruments TLV5608IYER
- Part Number:
- TLV5608IYER
- Manufacturer:
- Texas Instruments
- Ventron No:
- 3121914-TLV5608IYER
- Description:
- IC 8 CHANNEL DAC S/O DIE
- Datasheet:
- TLV5608,10IYE
Texas Instruments TLV5608IYER technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TLV5608IYER.
- Mounting TypeSurface Mount
- Package / CaseDie
- Supplier Device PackageDiesale
- Operating Temperature-40°C~85°C
- PackagingTape & Reel (TR)
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Output TypeVoltage - Buffered
- Number of Bits10
- ArchitectureString DAC
- Reference TypeExternal
- Data InterfaceSPI
- Differential OutputNo
- Voltage - Supply, Analog2.7V~3.3V 5V
- Voltage - Supply, Digital2.7V~3.3V 5V
- Settling Time7μs
- INL/DNL (LSB)±0.5, ±0.1
- Number of D/A Converters8
- RoHS StatusNon-RoHS Compliant
TLV5608IYER Overview
This package is included in the Die package and is available for purchase. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~85°C at all times. Using the Tape & Reel (TR) layout, this FPGA model can be contained in a very small amount of space. Device package Diesale is provided by its supplier.
TLV5608IYER Features
Die package
TLV5608IYER Applications
There are a lot of Rochester Electronics, LLC
TLV5608IYER Digital to Analog Converters (DAC) applications.
Motor Control
Data Distribution System
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators
This package is included in the Die package and is available for purchase. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~85°C at all times. Using the Tape & Reel (TR) layout, this FPGA model can be contained in a very small amount of space. Device package Diesale is provided by its supplier.
TLV5608IYER Features
Die package
TLV5608IYER Applications
There are a lot of Rochester Electronics, LLC
TLV5608IYER Digital to Analog Converters (DAC) applications.
Motor Control
Data Distribution System
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators
TLV5608IYER More Descriptions
2.7V to 5.5V, 12- And 10-Bit Octal DAC in Wafer Chip Scale Package 20-DIESALE -40 to 85
Converters - Digital to Analog (DAC) 2.7-5.5V, 12-10-Bit Octal DAC
DAC 8-CH Resistor-String 10-bit 20-Pin T/R
Converters - Digital to Analog (DAC) 2.7-5.5V, 12-10-Bit Octal DAC
DAC 8-CH Resistor-String 10-bit 20-Pin T/R
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