TLV5535IPWRG4Q1

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Texas Instruments TLV5535IPWRG4Q1

Part Number:

TLV5535IPWRG4Q1

Manufacturer:

Texas Instruments

Ventron No:

3011874-TLV5535IPWRG4Q1

Description:

IC ADC 8BIT PAR 35M 28TSSOP

ECAD Model:

Datasheet:

TLV5535IPWRG4Q1

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Delivery:

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  • 1

    $4.5695

    $4.57

  • 200

    $1.7687

    $353.74

  • 500

    $1.7068

    $853.40

  • 1000

    $1.6759

    $1675.90

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Part Overview

Description
The TLV5535 is an 8-bit, 35 MSPS, high-speed analog-to-digital converter (ADC). It converts analog input signals into 8-bit binary-coded digital words at sampling rates up to 35 MHz. All digital inputs and outputs are 3.3 V TTL/CMOS-compatible.

Features
Low power consumption: 90 mW typical using external references
Wide analog input bandwidth: 600 MHz typical
3.3 V single-supply operation
3.3 V TTL/CMOS-compatible digital I/O
Internal bottom and top reference voltages
Adjustable reference input range
Power-down (standby) mode
Separate power down for internal voltage references
Three-state outputs
28-pin thin shrink small-outline package (TSSOP)

Applications
Digital communications (IF sampling)
High-speed DSP front-end (TMS320C6000)
Video processing (scan rate/format conversion)
DVD read channel digitization

Specifications

Texas Instruments TLV5535IPWRG4Q1 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments TLV5535IPWRG4Q1.

  • Factory Lead Time
    20 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 5 days ago)
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-TSSOP (0.173, 4.40mm Width)
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    28
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    Automotive, AEC-Q100
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code
    EAR99
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Subcategory
    Analog to Digital Converters
  • Max Power Dissipation
    106mW
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    TLV5535
  • Pin Count
    28
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.6V
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Bipolar
  • Configuration
    S/H-ADC
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    1
  • Number of Bits
    8
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Single Ended
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    Pipelined
  • Converter Type

    Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

    ADC, PROPRIETARY METHOD
  • Supply Type
    Analog, Digital
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    External, Internal
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    Parallel
  • Resolution
    1 B
  • Sampling Rate

    Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

    35 Msps
  • Voltage - Supply, Analog
    3V~3.6V
  • Voltage - Supply, Digital
    3V~3.6V
  • Number of Analog In Channels
    1
  • Sampling Rate (Per Second)
    35M
  • Output Bit Code
    BINARY
  • Power Consumption
    106mW
  • Integral Nonlinearity (INL)
    2.4 LSB
  • Sample and Hold / Track and Hold
    SAMPLE
  • Number of Converters

    Number of Converters refers to the quantity of analog-to-digital converters (ADCs) or digital-to-analog converters (DACs) present in an electronic component. ADCs convert analog signals into digital form, while DACs perform the reverse operation. The number of converters determines the component's ability to handle multiple analog or digital signals simultaneously. A higher number of converters allows for increased data acquisition or signal generation capabilities.

    3
  • Conversion Rate
    35 Msps
  • Ratio - S/H:ADC

    Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

    1:1
  • Signal to Noise Ratio (SNR)
    46.5 dB
  • Max Supply Voltage (DC)
    3.6V
  • Min Supply Voltage (DC)
    3V
  • Spurious-free dynamic range (SFDR)
    58 dB
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1.2mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    9.7mm
  • Width
    4.4mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    1mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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